Patents by Inventor Lianpei ZHANG

Lianpei ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Evaporative cooling system
    Patent number: 11441847
    Abstract: An evaporative cooling system having a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device. The heat dissipating device comprises a second medium, and the evaporator is configured to receive heat from the heat conducting device to heat the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: September 13, 2022
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventors: Ting Tian, Lianpei Zhang
  • EVAPORATIVE COOLING SYSTEM
    Publication number: 20190293356
    Abstract: An evaporative cooling system having a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device. The heat dissipating device comprises a second medium, and the evaporator is configured to receive heat from the heat conducting device to heat the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device.
    Type: Application
    Filed: March 20, 2019
    Publication date: September 26, 2019
    Inventors: Ting TIAN, Lianpei ZHANG