Patents by Inventor LIAOLINGLING

LIAOLINGLING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120089758
    Abstract: At least one example embodiment discloses a System on Chip (SoC). The SoC includes a master block, a plurality of slave blocks configured to operate in response to a request from the master block, and an interconnect block configured to deliver transactions occurring in the master block to the plurality of slave blocks through a plurality of transfer paths. The interconnect block is configured to monitor load information of the plurality of transfer paths and select one of the plurality of transfer paths according to the load information.
    Type: Application
    Filed: July 8, 2011
    Publication date: April 12, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaegeun Yun, Bub-chul Jeong, Junhyung Um, Hyun-Joon Kang, Sung-Min Hong, LIAOLINGLING