Patents by Inventor Libin DING

Libin DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12650566
    Abstract: A service board includes a flexible board, at least one chip, and at least one optical cage layer. Each optical cage layer includes a plurality of optical cages. Each optical cage has an opening that faces a panel side and that is configured to connect to an optical module. The optical cage includes a housing and a plurality of signal pins. One end of the flexible board is electrically connected to tail ends of the plurality of signal pins, and another end of the flexible board is electrically connected to one chip, thereby shortening a connection path between the optical module and the chip, and reducing a link loss. Therefore, integration of the service board is improved, assembly is convenient, and a high-density connection and a simplified design of the service board are implemented, so that the service board is applicable to a high-density and high-speed transmission scenario.
    Type: Grant
    Filed: September 21, 2023
    Date of Patent: June 9, 2026
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Libin Ding, Hang Yan, Wenxue Zhu, Yang Liu, Xiang Guo, Wenliang Li
  • Publication number: 20260032820
    Abstract: This disclosure provides a circuit board and an electronic device. In addition to a PCB, the circuit board may further include an FPC assembled on the PCB. In addition, a line between different components assembled on the PCB includes a line in the PCB, and further includes a line in the FPC. Because a quantity of core boards in the FPC is generally far less than a quantity of core boards in the PCB, selecting a core board with a dielectric loss less than that of the core board in the PCB for the FPC helps reduce a transmission loss of a high-speed signal in the circuit board, and helps reduce costs of the circuit board. This disclosure further provides an electronic device. Selecting, for the electronic device, the circuit board provided in this disclosure helps improve cost competitiveness of the electronic device in a high-speed high-density scenario.
    Type: Application
    Filed: September 29, 2025
    Publication date: January 29, 2026
    Inventors: Xiang Guo, Libin Ding, Qun Zhang, Wenxue Zhu, Zhijun Qu, Xiaodong Wang, Changxing Sun
  • Publication number: 20240012214
    Abstract: A service board includes a flexible board, at least one chip, and at least one optical cage layer. Each optical cage layer includes a plurality of optical cages. Each optical cage has an opening that faces a panel side and that is configured to connect to an optical module. The optical cage includes a housing and a plurality of signal pins. One end of the flexible board is electrically connected to tail ends of the plurality of signal pins, and another end of the flexible board is electrically connected to one chip, thereby shortening a connection path between the optical module and the chip, and reducing a link loss. Therefore, integration of the service board is improved, assembly is convenient, and a high-density connection and a simplified design of the service board are implemented, so that the service board is applicable to a high-density and high-speed transmission scenario.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 11, 2024
    Inventors: Libin DING, Hang YAN, Wenxue ZHU, Yang LIU, Xiang GUO, Wenliang LI