Patents by Inventor Li-Bing Lu

Li-Bing Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting electronic components on printed circuit boards
    Patent number: 8011561
    Abstract: A method of mounting electronic components on a PCB, includes following steps. The PCB is placed with a first side of the PCB facing upwards. A plurality of solder is applied on bonding pads of the first side. A plurality of electronic components is stuck on the bonding pads of the first side. The PCB is turned over with a second side of the PCB facing upwards and the first side of the PCB facing downwards. A plurality of solder is applied on bonding pads of the second side. A plurality of electronic components is stuck on the bonding pads of the second side. The PCB is placed in a reflow oven to weld the electronic components on the first side and the second side of the PCB.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: September 6, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ji Ma, Li-Bing Lu, Hui Luo, Qi Huang
  • METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS
    Publication number: 20110167627
    Abstract: A method of mounting electronic components on a PCB, includes following steps. The PCB is placed with a first side of the PCB facing upwards. A plurality of solder is applied on bonding pads of the first side. A plurality of electronic components is stuck on the bonding pads of the first side. The PCB is turned over with a second side of the PCB facing upwards and the first side of the PCB facing downwards. A plurality of solder is applied on bonding pads of the second side. A plurality of electronic components is stuck on the bonding pads of the second side. The PCB is placed in a reflow oven to weld the electronic components on the first side and the second side of the PCB.
    Type: Application
    Filed: April 2, 2010
    Publication date: July 14, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JI MA, LI-BING LU, HUI LUO, QI HUANG