Abstract: An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R1, R2, R3, k, and X are as described herein.

Abstract: A curable resin that can have excellent heat resistance (a high glass transition temperature) and dielectric properties (low dielectric properties), the curable resin composition, and its cured product. Specifically, a curable resin (A) contains both a structure represented by General Formula (1) below and a structure represented by General Formula (2) below. (In the afomentioned General Formula (1), the details of the substituents and the number of the substituents are as described in the present specification.) (In the afomentioned General Formula (2), the details of the substituents and the number of the substituents are as described in the present specification.

Abstract: An object is to provide a cured product, for example, that is made with a curable resin composition containing a curable resin having a particular structure, a radical polymerization initiator, and a flame retardant and therefore is superior in flame retardancy, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties). Specifically, there are provided a curable resin represented by general formula (1) below and a curable resin composition containing this curable resin, a radical polymerization initiator (B), and a flame retardant (C). (In general formula (1) above, Y is a substituent represented by general formula (2) below, and the details of the substituents and the numbers of substituents presented in general formulae (1) and (2) above are as described in the text.

Abstract: Provided is a cured product having excellent heat resistance and dielectric properties (low dielectric properties) by using a curable resin characterized by having an indane skeleton. Specifically, provided are a curable resin having an indane skeleton represented by the following formula, a resin composition containing the same, and a cured product thereof. X is a (meth)acryloyl group; Ra and Rb are each an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12; j is an integer of 1 to 3; k and l are each an integer of 0 to 4; n is an average number of repeating units, being 0.5 to 20; and m is an integer of 0 to 2.

Abstract: An object of the present invention is to provide a curable resin composition having excellent solvent solubility, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties), and a cured article thereof. Specifically, the curable resin composition includes a curable resin (A) that has a repeating unit represented by General Formula (1) and contains one or more reactive groups selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group, and an allyl ether group as a terminal structure, and a curable compound (B) represented by General Formula (2). The details of the substituent represented by General Formula (1) and the number of substituents are as described in the specification. The details of the substituent represented by General Formula (2) and the number of substituents are as described in the specification.

Abstract: An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable resin, a radical polymerization initiator, and a fire retardant. Specifically provided are a curable resin represented by General Formula (1) and a curable resin composition containing the curable resin, a radical polymerization initiator (B), and a fire retardant (C): in the formula, Ra and Rb each independently represent an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon number of 1 to 12; k indicates an integer of 0 to 3; X represents a hydrocarbon group; and Y represents General Formula (2) or (3) below: in the formula, Z represents an alicyclic group, an aromatic group, or a heterocyclic group.

Abstract: An object is to provide a curable resin composition that can provide its cured product with excellent heat resistance (a high glass transition temperature) and dielectric properties (low dielectric properties) and the cured product. Specifically, provided is a curable resin composition containing a curable resin (A) having a structure represented by General Formula (1) below and a curable resin (B1) having a structure represented by General Formula (2-1) below and/or a curable compound (B2) represented by General Formula (2-2) below: in General Formula (1) above, the details of the substituents and the number of the substituents are as described in the present specification. in General Formulae (2-1) and (2-2) above, the details of the substituents and the number of the substituents are as described in the present specification.

Abstract: An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable resin, a radical polymerization initiator, and a fire retardant. Specifically provided are a curable resin represented by General Formula (1) and a curable resin composition containing the curable resin, a radical polymerization initiator (B), and a fire retardant (C): in the formula, Ra and Rb each independently represent an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon number of 1 to 12; k indicates an integer of 0 to 3; X represents a hydrocarbon group; and Y represents General Formula (2) or (3) below: in the formula, Z represents an alicyclic group, an aromatic group, or a heterocyclic group.

Abstract: An object is to provide a cured product superior in heat resistance (high glass transition temperature) and dielectric properties (low dielectric properties) by using a curable resin having a specific structure and superior in storage stability. Specifically, a curable resin represented by general formula (1) below and having a hydroxyl group concentration of 0.005 to 3800 mmol/kg is provided.

Abstract: An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R1, R2, R3, k, and X are as described herein.

Abstract: An object is to provide a cured product, for example, that is made with a curable resin composition containing a curable resin having a particular structure, a radical polymerization initiator, and a flame retardant and therefore is superior in flame retardancy, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties). Specifically, there are provided a curable resin represented by general formula (1) below and a curable resin composition containing this curable resin, a radical polymerization initiator (B), and a flame retardant (C). (In general formula (1) above, Y is a substituent represented by general formula (2) below, and the details of the substituents and the numbers of substituents presented in general formulae (1) and (2) above are as described in the text.

Abstract: Provided is a cured product having excellent heat resistance and dielectric properties (low dielectric properties) by using a curable resin characterized by having an indane skeleton. Specifically, provided are a curable resin having an indane skeleton represented by the following formula, a resin composition containing the same, and a cured product thereof. X is a (meth)acryloyl group; Ra and Rb are each an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12; j is an integer of 1 to 3; k and 1 are each an integer of 0 to 4; n is an average number of repeating units, being 0.5 to 20; and m is an integer of 0 to 2.