Patents by Inventor Lichen ZHANG

Lichen ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079802
    Abstract: The present application provides a high-power semiconductor light-emitting chip with longitudinal carrier modulation and a manufacturing method therefor.
    Type: Application
    Filed: May 29, 2023
    Publication date: March 6, 2025
    Applicant: SUZHOU EVERBRIGHT PHOTONICS CO., LTD.
    Inventors: Shaoyang TAN, Jun WANG, Lichen ZHANG, Wu ZHAO, Guoliang DENG, Huomu YANG, Hao ZHOU, Hong ZHANG, Xinsheng LIAO
  • Publication number: 20240222931
    Abstract: A high-reliability low-defect semiconductor light-emitting device and a method for manufacturing same. The high-reliability low-defect semiconductor light-emitting device includes: a semiconductor substrate layer; an active layer arranged on the semiconductor substrate layer; a doped semiconductor contact layer arranged on a side of the active layer away from the semiconductor substrate layer, where the doped semiconductor contact layer includes a first area and an edge area surrounding the first area; a protection layer arranged on a side of the edge area of the doped semiconductor contact layer away from the active layer; and a front electrode layer, arranged on a side of the first area away from the active layer, where an upper surface of the front electrode layer in the first area is lower than an upper surface of the protection layer. The semiconductor light-emitting device has both high reliability and reduced process control costs.
    Type: Application
    Filed: July 20, 2022
    Publication date: July 4, 2024
    Applicant: Everybright Institute of Semiconductor Photonics Co., Ltd.
    Inventors: Jun WANG, Shaoyang Tan, Lichen Zhang, Yiwen Hu, Wu Zhao, Bo Li, Quanling Li
  • Publication number: 20240222547
    Abstract: A multi-active area semiconductor structure and a method for manufacturing same.
    Type: Application
    Filed: July 20, 2022
    Publication date: July 4, 2024
    Inventors: Jun WANG, Yudan Gou, Li Zhou, Yang Cheng, Shaoyang Tan, Lichen Zhang, Bo Li
  • Publication number: 20190109437
    Abstract: Provided are an ion air supply module needle net layout method and an ion air supply module. The layout method comprises: step 1, a wind speed test: adjusting a distance between a single discharge needle and a metal net, so that an ion wind speed at the wind speed central point position of the metal net is at the maximum, and measuring a distance value L between a tip of the discharge needle and the metal net; step 2, a projection radius measurement: measuring a wind speed Vr deviating from the wind speed central point position, and when Vr=aVmax, measuring that the distance between a wind speed measurement point and a wind speed central point is r; and step 3, a needle net layout: setting the distance between the tip of the discharge needle and the metal net to be within the range of (0.7-1.3)L, with the distance between tips of two adjacent discharge needles being within the range of (0.7-1.3)r.
    Type: Application
    Filed: May 31, 2016
    Publication date: April 11, 2019
    Applicants: QINGDAO HAIER SMART TECHNOLOGY R & D CO., LTD, HARBIN INSTITUTE OF TECHNOLOGY
    Inventors: Jingfeng TANG, Liqiu WEI, Daren YU, Yongtao WANG, Lichen ZHANG, Jian LI, Jingjing WANG, Zhuang MA, Linqiang TANG
  • Patent number: D948086
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: April 5, 2022
    Inventors: Jinlong Du, Kai Qiao, Xin Zhao, Lichen Zhang