Patents by Inventor Licheng Marshal Han

Licheng Marshal Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Opening in a multilayer polymeric dielectric layer without delamination
    Patent number: 10546821
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • OPENING IN A MULTILAYER POLYMERIC DIELECTRIC LAYER WITHOUT DELAMINATION
    Publication number: 20170033057
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • Opening in a multilayer polymeric dielectric layer without delamination
    Patent number: 9502365
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: November 22, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • OPENING IN A MULTILAYER POLYMERIC DIELECTRIC LAYER WITHOUT DELAMINATION
    Publication number: 20150187711
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Application
    Filed: December 19, 2014
    Publication date: July 2, 2015
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • Integrated Circuit Die And Method Of Fabricating
    Publication number: 20130193569
    Abstract: Integrated circuit dies and methods of fabricating the dies are disclosed. An embodiment of a method includes providing a die having a redistribution layer fabricated thereon. The redistribution layer has a surface located thereon that is free of any seed layers. An under bump metal layer is fabricated directly to the surface.
    Type: Application
    Filed: January 31, 2012
    Publication date: August 1, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Licheng Marshal Han, Christopher Daniel Manack, Michael Andrew Serafin
  • Integrated circuit dielectric and method
    Publication number: 20040185678
    Abstract: Pulsed plasma deposition of polymers as dielectrics for integrated circuit interconnects fills minimal gaps and yields a porous polymer with thermal stability by plasma off times sufficiently long to dissipate plasma on time energy input plus an anneal of the deposited polymer to drive off occluded monomers and small oligomers.
    Type: Application
    Filed: August 21, 2003
    Publication date: September 23, 2004
    Inventors: Wei William Lee, Richard B. Timmons, Licheng Marshal Han
  • Method of forming a polymer on a surface
    Patent number: 6214423
    Abstract: Pulsed plasma deposition of polymers as dielectrics for integrated circuit interconnects fills minimal gaps and yields a porous polymer with thermal stability by plasma off times sufficiently long to dissipate plasma on time energy input plus an anneal of the deposited polymer to drive off occluded monomers and small oligomers.
    Type: Grant
    Filed: April 15, 1999
    Date of Patent: April 10, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Wei William Lee, Richard B. Timmons, Licheng Marshal Han