Patents by Inventor Li-Chih Yang

Li-Chih Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Colored thin covering film and manufacturing method
    Patent number: 11116074
    Abstract: A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 ?m, and the thickness of the low dielectric glue layer is between 3 to 25 ?m, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 ?m. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: September 7, 2021
    Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.
    Inventors: Wei-Chih Lee, Li-Chih Yang, Chien-Hui Lee
  • COLORED THIN COVERING FILM AND MANUFACTURING METHOD
    Publication number: 20180249572
    Abstract: A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 ?m, and the thickness of the low dielectric glue layer is between 3 to 25 ?m, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 ?m. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.
    Type: Application
    Filed: December 14, 2017
    Publication date: August 30, 2018
    Inventors: Wei-Chih Lee, Li-Chih Yang, Chien-Hui Lee