Patents by Inventor Lidia Tarnawska

Lidia Tarnawska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer with a layer of AlGaN and process for producing it
    Patent number: 9147726
    Abstract: A semiconductor wafer contains the following layers in the given order: a monocrystalline substrate wafer (1) consisting predominantly of silicon and having a (111) surface orientation, a monocrystalline layer (3) of Sc2O3 having a (111) surface orientation, a monocrystalline layer (4) of ScN having a (111) surface orientation, and a monocrystalline layer (6) of AlzGa1-zN with 0?z?1 having a (0001) surface orientation, the semiconductor wafers are produced by appropriate deposition of the respective layers.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: September 29, 2015
    Assignee: Siltronic AG
    Inventors: Sarad Bahadur Thapa, Thomas Schroeder, Lidia Tarnawska
  • Semiconductor Wafer With A LayerOf AlzGa1-zN and Process For Producing It
    Publication number: 20140264776
    Abstract: A semiconductor wafer contains the following layers in the given order: a monocrystalline substrate wafer (1) consisting predominantly of silicon and having a (111) surface orientation, a monocrystalline layer (3) of Sc2O3 having a (111) surface orientation, a monocrystalline layer (4) of ScN having a (111) surface orientation, and a monocrystalline layer (6) of AlzGa1-zN with 0?z?1 having a (0001) surface orientation, the semiconductor wafers are produced by appropriate deposition of the respective layers.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 18, 2014
    Applicant: Siltronic AG
    Inventors: Sarad Bahadur Thapa, Thomas Schroeder, Lidia Tarnawska