Patents by Inventor Lie Shan

Lie Shan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer
    Patent number: 7033927
    Abstract: The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: April 25, 2006
    Assignee: International Business Machines Corporation
    Inventors: Guy M. Cohen, Daniel C. Edelstein, Keith A. Jenkins, Chirag S. Patel, Lie Shan
  • Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer
    Publication number: 20050282381
    Abstract: The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate.
    Type: Application
    Filed: June 22, 2004
    Publication date: December 22, 2005
    Inventors: Guy Cohen, Daniel Edelstein, Keith Jenkins, Chirag Patel, Lie Shan