Patents by Inventor Liedong WANG

Liedong WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11632879
    Abstract: The present disclosure discloses a heat dissipation plate for chip heat dissipation, a server heat dissipation system, and a heating device. One end of the heat dissipation plate may be blocked. Another end of the heat dissipation plate may be provided with a water inlet and a water outlet. A pipeline assembly in the heat dissipation plate may include a plurality of branch water inlet pipelines and a plurality of branch outlet pipelines. One end of the plurality of branch water inlet pipelines may operably connect to the water inlet. One end of the plurality of branch water outlet pipelines may operably connect to the water outlet. Another end of the plurality of branch water inlet pipelines may be operably connected to another end of the plurality of branch water outlet pipelines through a connection pipeline.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: April 18, 2023
    Assignee: HANGZHOU DARERUOHAN TECHNOLOGY CO., LTD.
    Inventors: Risheng Li, Yunfeng Liu, Liedong Wang
  • Publication number: 20210372712
    Abstract: The present disclosure may disclose cooling devices, including a cooling plate. One or more cooling pipelines may be formed inside the cooling plate. The cooling pipelines may include an inlet pipe, an outlet pipe and one or more connecting pipes. The inlet pipe and the outlet pipe may traverse the cooling plate along a first direction and one end of each of the inlet pipe and the outlet pipe may be blocked. The one or more connecting pipes may traverse the cooling plate along a second direction and both ends of each of the one or more connecting pipes may be blocked, and the inlet pipe and the outlet pipe may be interconnected with two end portions of each of the one or more connecting pipes, respectively, so that a coolant may flow in the cooling device.
    Type: Application
    Filed: April 8, 2021
    Publication date: December 2, 2021
    Applicant: HANGZHOU DARERUOHAN TECHNOLOGY CO., LTD.
    Inventors: Risheng LI, Yunfeng LIU, Liedong WANG, Jun XU
  • Publication number: 20210227724
    Abstract: The present disclosure discloses a heat dissipation plate for chip heat dissipation, a server heat dissipation system, and a heating device. One end of the heat dissipation plate may be blocked. Another end of the heat dissipation plate may be provided with a water inlet and a water outlet. A pipeline assembly in the heat dissipation plate may include a plurality of branch water inlet pipelines and a plurality of branch outlet pipelines. One end of the plurality of branch water inlet pipelines may operably connect to the water inlet. One end of the plurality of branch water outlet pipelines may operably connect to the water outlet. Another end of the plurality of branch water inlet pipelines may be operably connected to another end of the plurality of branch water outlet pipelines through a connection pipeline.
    Type: Application
    Filed: April 2, 2021
    Publication date: July 22, 2021
    Applicant: BEIJING SAI TECHNOLOGY CO., LTD.
    Inventors: Risheng LI, Yunfeng LIU, Liedong WANG