Abstract: A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened in the certain position on the circuit board to hold the heat sink on the circuit board. Because the heat sink only needs the arms and the fasteners to be held securely on the circuit board, the manufacturing and assembling procedures are effectively reduced.

Abstract: A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid therein. At least one liquid inlet and liquid outlet are defined on the casing and communicated through the second compartment. Therefore, the liquid driving unit and the cooling plate module can be advantageously integrated into the casing while the duct is reduced to achieve compact space. Moreover, the overall structure achieves liquid storing, circulating and heat conveying function.

Abstract: A water-cooling heat exchanger and a heat-dissipating device are mounted on a heat-generating element of a computer for rapidly guiding and dissipating the heat generated by the heat-generating element. A water-cooling head, a pump and a heat-dissipating fan are stacked up, and an annular heat exchanger is used to surround the above components, thereby to reduce the space of the whole construction to a lowest extent. With the heat-dissipating fan provided in the center of the annular heat exchanger, the airflow generated by the heat-dissipating fan can blow the heat exchanger in multiple directions, thereby to obtain the optimal effect of heat dissipation.

Abstract: A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened in the certain position on the circuit board to hold the heat sink on the circuit board. Because the heat sink only needs the arms and the fasteners to be held securely on the circuit board, the manufacturing and assembling procedures are effectively reduced.

Abstract: A water-cooling heat exchanger and a heat-dissipating device are mounted on a heat-generating element of a computer for rapidly guiding and dissipating the heat generated by the heat-generating element. A water-cooling head, a pump and a heat-dissipating fan are stacked up, and an annular heat exchanger is used to surround the above components, thereby to reduce the space of the whole construction to a lowest extent. With the heat-dissipating fan provided in the center of the annular heat exchanger, the airflow generated by the heat-dissipating fan can blow the heat exchanger in multiple directions, thereby to obtain the optimal effect of heat dissipation.

Abstract: A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid therein. At least one liquid inlet and liquid outlet are defined on the casing and communicated through the second compartment. Therefore, the liquid driving unit and the cooling plate module can be advantageously integrated into the casing while the duct is reduced to achieve compact space. Moreover, the overall structure achieves liquid storing, circulating and heat conveying function.