Patents by Inventor Lien-Cheng Tsai

Lien-Cheng Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method for reducing electromagnetic interference
    Patent number: 9775267
    Abstract: A structure for reducing electromagnetic interference is provided, which includes a circuit board, an expansion slot and an electrical conductor. The circuit board has an upper surface and a ground circuit. The expansion slot is disposed on the upper surface of the circuit board, and has at least one metal pin electrically connected to the circuit board. The electrical conductor is located above the upper surface of the circuit board, and a gap is maintained between the electrical conductor and the metal pin of the expansion slot to produce a capacitor. A method for reducing electromagnetic interference is further provided, for accomplishing the above-mentioned structure.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: September 26, 2017
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Min-Yuan Yang, Chien-Hsiang Huang, Hsin-Hong Wu, Lien-Cheng Tsai
  • STRUCTURE AND METHOD FOR REDUCING ELECTROMAGNETIC INTERFERENCE
    Publication number: 20170034962
    Abstract: A structure for reducing electromagnetic interference is provided, which includes a circuit board, an expansion slot and an electrical conductor. The circuit board has an upper surface and a ground circuit. The expansion slot is disposed on the upper surface of the circuit board, and has at least one metal pin electrically connected to the circuit board. The electrical conductor is located above the upper surface of the circuit board, and a gap is maintained between the electrical conductor and the metal pin of the expansion slot to produce a capacitor. A method for reducing electromagnetic interference is further provided, for accomplishing the above-mentioned structure.
    Type: Application
    Filed: July 19, 2016
    Publication date: February 2, 2017
    Inventors: Min-Yuan Yang, Chien-Hsiang Huang, Hsin-Hong Wu, Lien-Cheng Tsai