Patents by Inventor Lien CHIEN

Lien CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170012763
    Abstract: A multiband filter circuitry utilized in a radio-frequency (RF) system is disclosed. The multiband filter circuitry operates at a plurality of operating frequency bands. The multiband filter circuitry comprises at least a switchable-filtering series. Each of the at least a switchable-filtering series comprises a first terminal coupled between the antenna and the RF processing unit; a second terminal coupled to a ground; and a plurality of switchable-filtering units connected in series, each comprising a filtering unit; and a switching unit, connected to the filtering unit in parallel.
    Type: Application
    Filed: July 8, 2015
    Publication date: January 12, 2017
    Inventors: Min-Shou Wu, Lien Chien, Yi-Chun Huang
  • Patent number: 9184772
    Abstract: An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: November 10, 2015
    Assignee: MEDIATEK INC.
    Inventors: Hsin-Ying Lee, Chi-Sheng Yu, Lien Chien
  • Publication number: 20130237164
    Abstract: A radio frequency (RF) module capable of self-calibration is provided. According to an embodiment, the RF module includes an RF signal processor, a plurality of RF signal paths, an antenna switch module (ASM), and a power detector. The RF signal paths are connected between the RF signal processor and the ASM. The ASM has an antenna port and selectively connects the RF signal processor to the antenna port through one of the RF signal paths. The power detector is operative to detect power of an RF transmission signal that exits the antenna port of the ASM and enters an antenna when the ASM connects an RF transmission path of the RF signal paths to the antenna port of the ASM.
    Type: Application
    Filed: March 11, 2012
    Publication date: September 12, 2013
    Inventors: Lien Chien, Hsin-Ying Lee
  • Patent number: 8526890
    Abstract: A radio frequency (RF) module capable of self-calibration is provided. According to an embodiment, the RF module includes an RF signal processor, a plurality of RF signal paths, an antenna switch module (ASM), and a power detector. The RF signal paths are connected between the RF signal processor and the ASM. The ASM has an antenna port and selectively connects the RF signal processor to the antenna port through one of the RF signal paths. The power detector is operative to detect power of an RF transmission signal that exits the antenna port of the ASM and enters an antenna when the ASM connects an RF transmission path of the RF signal paths to the antenna port of the ASM.
    Type: Grant
    Filed: March 11, 2012
    Date of Patent: September 3, 2013
    Assignee: Mediatek Inc.
    Inventors: Lien Chien, Hsin-Ying Lee
  • Publication number: 20130100623
    Abstract: An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier.
    Type: Application
    Filed: July 30, 2012
    Publication date: April 25, 2013
    Applicant: MEDIATEK INC.
    Inventors: Hsin-Ying LEE, Chi-Sheng YU, Lien CHIEN