Patents by Inventor Lien-Chung Hsu
Lien-Chung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230041833Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.Type: ApplicationFiled: July 5, 2022Publication date: February 9, 2023Applicant: MICROCOSM TECHNOLOGY CO., LTD.Inventors: Steve Lien-chung Hsu, Yu-Ching Lin, Yu-Chiao Shih, Hou-Chieh Cheng
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Patent number: 11426793Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.Type: GrantFiled: December 3, 2018Date of Patent: August 30, 2022Assignee: National Cheng Kung UniversityInventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
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Publication number: 20220204698Abstract: The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.Type: ApplicationFiled: August 17, 2021Publication date: June 30, 2022Applicant: MICROCOSM TECHNOLOGY CO., LTD.Inventors: Steve Lien-chung Hsu, Chun-Heng Chen, Bo-Hung Lai, Yu-Chiao Shih
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Patent number: 11331723Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.Type: GrantFiled: April 25, 2018Date of Patent: May 17, 2022Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTREInventors: Hung-Tao Chen, Chang-Shu Kuo, In-Gann Chen, Steve Lien-Chung Hsu, Chi-Wah Keong
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Publication number: 20200171578Abstract: A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: In-Gann Chen, Hung-Cheng Chen, Chia-Ming Yang, Steve Lien-Chung Hsu, Chang-Shu Kuo
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Publication number: 20190134714Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.Type: ApplicationFiled: April 25, 2018Publication date: May 9, 2019Inventors: Hung-Tao CHEN, Chang-Shu KUO, In-Gann CHEN, Steve Lien-Chung HSU, Chi-Wah KEONG
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Patent number: 9902862Abstract: A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10?5 ?·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.Type: GrantFiled: July 6, 2016Date of Patent: February 27, 2018Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Steve Lien-Chung Hsu, Yen-Ting Chen, In-Gann Chen
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Publication number: 20180009998Abstract: A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10?5 ?·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.Type: ApplicationFiled: July 6, 2016Publication date: January 11, 2018Inventors: Steve Lien-Chung Hsu, Yen-Ting Chen, In-Gann Chen
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Patent number: 9705146Abstract: A method is provided to fabricate an electrolyte membrane. The membrane has an asymmetric structure and is a polybenzimidazole membrane doped with phosphoric acid. The asymmetric structure comprises a dense layer and a porous layer. The content of phosphoric acid introduced into the polybenzimidazole membrane reaches 20 phosphoric acid molecules per polymer repeating unit. The proton conductivity of the polybenzimidazole membrane reaches 5×10?2 siemens per centimeter (S/cm). An electrode made with the polybenzimidazole membrane can be smoothly operated in a proton exchange membrane fuel cell.Type: GrantFiled: December 29, 2014Date of Patent: July 11, 2017Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Steve Lien-Chung Hsu, Li-cheng Jheng
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Publication number: 20160190625Abstract: A method is provided to fabricate an electrolyte membrane. The membrane has an asymmetric structure and is a polybenzimidazole membrane doped with phosphoric acid. The asymmetric structure comprises a dense layer and a porous layer. The content of phosphoric acid introduced into the polybenzimidazole membrane reaches 20 phosphoric acid molecules per polymer repeating unit. The proton conductivity of the polybenzimidazole membrane reaches 5×10?2 siemens per centimeter (S/cm). An electrode made with the polybenzimidazole membrane can be smoothly operated in a proton exchange membrane fuel cell.Type: ApplicationFiled: December 29, 2014Publication date: June 30, 2016Inventors: Steve Lien-Chung Hsu, Li-cheng Jheng
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Publication number: 20100009185Abstract: An enameled wire containing a nano-filler includes a metallic wire and at least one layer of insulating coating. At least one layer of the at least one layer of insulating coating includes a nano-filler. The nano-filler is a modified silicon dioxide slurry comprising silicon dioxide, organic solvent and organic silane coupling agent. The nano-filler comprises silicon dioxide modified with an organic silane coupling agent to improve dispersion of the nano-filler and maintain properties of the insulating coating. In addition, material and manufacturing costs of the enameled wire can be lowered.Type: ApplicationFiled: July 14, 2008Publication date: January 14, 2010Inventors: Tsang-Tse Fang, Steve Lien-Chung Hsu, Hsing-I Hsiang, Han-Yang Chung, Ting-I Lu, Chih-Wei Hsu, Chun-Hung Chen, Jung-Kun Chiu, Shang-Hui Shen
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Patent number: 7618574Abstract: A synthesis for a silated acidic polymer by a copolymerization of several monomers includes one acidic monomer and one silated monomer. The silated acidic polymer is used as a resist barrier in imprint lithography and is easily removed by an environmental basic aqua-solution during the stripping process without using RIE (reactive ion etching) process or organic solvent at the last step of resist stripping so that the throughput is enhanced and good etching resistibility together with cost-saving is obtained.Type: GrantFiled: July 14, 2005Date of Patent: November 17, 2009Assignee: National Cheng Kung UniversityInventors: Lien-Chung Hsu, Weng-Chung Liao, Min-Hsiung Hon, Chau-Nan Hong
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Publication number: 20090136441Abstract: A nano-scaled antifouling paint for boat is fabricated. A few hydrophobic nano-particles are added into the paint to obtain a nanostructure and a low surface energy. Thus, sea creatures are hard to adhere on the boat or are easily removed. Moreover, owing to a low wettability of the paint, a water drag is reduced when the boat sails, and so fuel is saved.Type: ApplicationFiled: September 5, 2007Publication date: May 28, 2009Applicant: Fisheries Agency, Council of Agriculture, Executive YuanInventors: Steve Lien-Chung Hsu, Tsang-Tse Fang, Hsing-I Hsiang, Ming-Chung Fang
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Publication number: 20070012652Abstract: The present invention processes a synthesis for a silated acidic polymer by a copolymerization of several monomers including one acidic monomer and one silated monomer. The silated acidic polymer is used as a resist barrier in imprint lithography and is easily removed by an environmental basic aqua-solution during the stripping process without using RIE (reactive ion etching) process or organic solvent at the last step of resist stripping so that the throughput is enhanced and good etching resistibility together with cost-saving is obtained.Type: ApplicationFiled: July 14, 2005Publication date: January 18, 2007Inventors: Lien-Chung Hsu, Weng-Chung Liao, Min-Hsiung Hon, Chau-Nan Hong
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Patent number: 7081491Abstract: A method for fabricating a polybenzoxazole/clay nanocomposite material includes performing an ion exchange reaction between an organic amine and Na+-montmorillonite to form a swelled organoclay. A polycondensation reaction is conducted between two types of monomers, isophthaloyl chloride and 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane to form a polybenzoxaxole precursor polyhydroxyamide to form a PBO/clay composite material.Type: GrantFiled: December 9, 2002Date of Patent: July 25, 2006Assignee: National Cheng-Kung UniversityInventors: Steve Lien-Chung Hsu, Keng-Chuan Chang
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Patent number: 7063939Abstract: The present invention relates a method for high aspect ratio pattern transfer, by using combination of imprint and Step and Flash techniques to transfer high aspect ratio pattern. The present invention simultaneously saves the developing time and the amount of developer used during the photo-resist pattern transfer process. The present invention is able to avoid separation and dissolution between pattern and substrate that is attacked by developer, and is able to yield high aspect ratio patterns.Type: GrantFiled: February 20, 2004Date of Patent: June 20, 2006Assignee: National Cheng Kung UniversityInventors: Weng-Chung Liao, Lien-Chung Hsu, Po-I Lee, Min-Hsiung Hon, Chau-Nan Hong
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Patent number: 7056641Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.Type: GrantFiled: July 8, 2005Date of Patent: June 6, 2006Assignee: Arch Specialty Chemicals, Inc.Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
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Patent number: 6939659Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.Type: GrantFiled: March 4, 2004Date of Patent: September 6, 2005Assignee: Arch Specialty Chemicals, Inc.Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu
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Publication number: 20050026090Abstract: The present invention relates a method for high aspect ratio pattern transfer, by using combination of imprint and Step and Flash techniques to transfer high aspect ratio pattern. The present invention simultaneously saves the developing time and the amount of developer used during the photo-resist pattern transfer process. The present invention is able to avoid separation and dissolution between pattern and substrate that is attacked by developer, and is able to yield high aspect ratio patterns.Type: ApplicationFiled: February 20, 2004Publication date: February 3, 2005Inventors: Weng-Chung Liao, Lien-Chung Hsu, Po-I Lee, Min-Hsiung Hon, Chau-Nan Hong
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Publication number: 20040229167Abstract: A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.Type: ApplicationFiled: March 4, 2004Publication date: November 18, 2004Applicant: ARCH SPECIALTY CHEMICALS, INC.Inventors: Ahmad A. Naiini, William D. Weber, Pamela D. Waterson, Steve Lien-Chung Hsu