Abstract: A heat-dissipating circuit board assembly is composed of a heat-conducting base board and a circuit board. The heat-conducting base board includes an insulating heat-conducting layer disposed thereon and a plurality of bonding pads disposed on the insulating heat-conducting layer and never connected with one another. The circuit board that is single-layered or multiple-layered includes a plurality of electronic components at at least one side thereof and a plurality of heat-dissipating zones at a side thereof. The heat-dissipating zones are connected with heat-generating elements of the electronic components and in a corresponding position to the bonding pads. The heat-conducting base board is connected with the heat-conducting base board by the melted bonding pads that are melted by heating and further disposed therebetween.