Patents by Inventor Lien-Jung Lee

Lien-Jung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154015
    Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
  • Patent number: 6049457
    Abstract: A device which can effectively fasten a heat dissipator to a CPU by a simple operation is disclosed. The device includes a pair of fasteners respectively received in a corresponding channel defined in a surface of the heat dissipator, each fastener being configured as a strip and having a first arm and a second arm respectively extending from two ends thereof. A pair of control bars each has a first end engaged with the first arm of the corresponding fastener and a second end engaged with the second arm of a corresponding fastener. A driving lever two separated arms respectively engaged with the first arms of the pair of fasteners. The driving lever is operable to drive the control bar, thereby enabling the fasteners to grippingly secure the heat dissipator to the CPU.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: April 11, 2000
    Inventor: Lien-Jung Lee
  • Patent number: 5299632
    Abstract: A fin device includes a plate having a bottom surface for contacting an upper surface of an integrated circuit and an upper surface from which two opposite end walls extend upward. A plurality of rows of fins extend between the opposite end walls and extend upward from the upper surface of the plate. A substantially L-shaped member extends outward and upward from each fin of first and last rows which are adjacent to and extend parallel to the opposite end walls. Each L-shaped member extends to a height above the fins. The fins of the first and last rows respectively define a groove with associated adjacent end walls for receiving at least one snapping fastener. Each snapping fastener is substantially T-shaped, including a substantially inverted L-shaped portion with a distal snapping head at an end thereof and two arms extending laterally from the other end thereof. The arms have a recessed portion at an underside thereof.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: April 5, 1994
    Inventor: Lien-Jung Lee