Patents by Inventor Lieneng LOW

Lieneng LOW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seal ring bonding structures
    Patent number: 10811361
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to seal ring structures with channels and methods of manufacture. The structure includes: a first wafer having a channel formed within a passivation layer; a second wafer having a protuberance which is insertable into the channel and which is bonded to the first wafer with eutectic bonding materials; and a plurality of stoppers or tabs extending within the channel and which provides a gap that has a dimension smaller than a gap formed in other portions of the channel.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: October 20, 2020
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
    Inventors: Lieneng Low, Teck Wee Christopher Lim, Wai Mun Chong, Wan Tak Ng
  • SEAL RING BONDING STRUCTURES
    Publication number: 20190378798
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to seal ring structures with channels and methods of manufacture. The structure includes: a first wafer having a channel formed within a passivation layer; a second wafer having a protuberance which is insertable into the channel and which is bonded to the first wafer with eutectic bonding materials; and a plurality of stoppers or tabs extending within the channel and which provides a gap that has a dimension smaller than a gap formed in other portions of the channel.
    Type: Application
    Filed: June 12, 2018
    Publication date: December 12, 2019
    Inventors: Lieneng LOW, Teck Wee Christopher LIM, Wai Mun CHONG, Wan Tak NG