Patents by Inventor Liesong Cai

Liesong Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder preform
    Patent number: 11207748
    Abstract: A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: December 28, 2021
    Inventors: Hangwei Cai, Kun Du, Liesong Cai, Minghan Chen
  • SOLDER PREFORM
    Publication number: 20210039206
    Abstract: A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.
    Type: Application
    Filed: September 6, 2018
    Publication date: February 11, 2021
    Inventors: Hangwei CAI, Kun DU, Liesong CAI, Minghan CHEN
  • Reducing dross method of lead-free solder
    Patent number: 8557016
    Abstract: A reducing dross method of lead-free solder includes the steps of: producing master alloy of reducing dross which comprises Sn and 0.1 to 0.8 wt % P; analyzing the percentage of P of the lead-free solder to be modified, in order to reach 0.008 to 0.015 wt % P in the lead-free solder, adding the master alloy into the lead-free solder with the percentage of P less than 0.008 wt % or no P; then sampling the lead-free solder at regular intervals to determine the percentage and the percentage loss of P, if the percentage of P being less than a given value from 0.008 to 0.015 wt %, adding the master alloy to keep the percentage of P as 0.008 to 0.015 wt %.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: October 15, 2013
    Assignee: Guangzhou Solderwell Enterprise Co., Ltd.
    Inventors: Kun Du, Minghan Chen, Xin Chen, Liesong Cai
  • REDUCING DROSS METHOD OF LEAD-FREE SOLDER
    Publication number: 20110219914
    Abstract: A reducing dross method of lead-free solder includes the steps of: producing master alloy of reducing dross which comprises Sn and 0.1 to 0.8 wt % P; analyzing the percentage of P in the lead-free solder to be modified, in order to reach 0.008 to 0.015 wt % P in the lead-free solder, adding the master alloy into the lead-free solder with the percentage of P less than 0.008 wt % or no P; then sampling the lead-free solder at regular intervals to determine the percentage and the percentage loss of P, if the percentage of P being less than a given value between 0.008 to 0.015 wt %, adding the master alloy to keep the percentage of P within 0.008 to 0.015 wt %.
    Type: Application
    Filed: June 11, 2009
    Publication date: September 15, 2011
    Inventors: Kun Du, Minghan Chen, Xin Chen, Liesong Cai