Patents by Inventor Lie-zhong Gong

Lie-zhong Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8362125
    Abstract: Hot melt packaging adhesives comprising a base polymer component, a tackifier component and a wax component, which wax component comprises a soy wax, and are described.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: January 29, 2013
    Assignee: Henkel AG & Co. KGAA
    Inventors: Lie-Zhong Gong, Dale L. Haner, Charles W. Paul, Qiwei He, Abhi Narthana
  • Publication number: 20080249216
    Abstract: Hot melt packaging adhesives comprising a base polymer component, a tackifier component and a wax component, which wax component comprises a soy wax, and are described.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 9, 2008
    Inventors: Lie-Zhong Gong, Dale L. Haner, Charles W. Paul, Qiwei He, Abhi Narthana
  • Publication number: 20080249233
    Abstract: Low application temperature hot melt packaging adhesives comprising a vegetable derived wax such as a soy wax are described.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 9, 2008
    Inventors: Dale L. Haner, Lie-Zhong Gong
  • Patent number: 7378481
    Abstract: A hot melt adhesive based on a functionalized metallocene polyethylene copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: May 27, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Lie-Zhong Gong, Dale L. Haner, Ingrid Cole
  • Publication number: 20080009573
    Abstract: Dye-labeled tackifiers increase dye solubility/compatibility and provide an improved means of introducing dyes into products such as inks, adhesives and coatings. When the dyes are radiation absorbing dyes, the dye-labeled tackifiers can serve as thermal transducers, and can be used in applications where it is required to cause a thermoplastic material to melt or to soften, for example a hot-melt composition.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 10, 2008
    Inventors: Ching Wah Chong, Mitchell Alan Winnik, Hao-Qiang Zhan, James W. Nowicki, Lie-Zhong Gong
  • Patent number: 7208541
    Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: April 24, 2007
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Lie-zhong Gong, Melissa L. Allen, Justin A. Mehaffy, Darshak R. Desai, Dale L. Haner, Tuyet Le
  • Publication number: 20070031625
    Abstract: Low application temperature hot melt adhesives are advantageously used to releaseably bond an article, such as a plastic bottle to a base material, such as a cardboard palette.
    Type: Application
    Filed: August 4, 2005
    Publication date: February 8, 2007
    Inventors: Lie-zhong Gong, Abhi Narthana
  • Publication number: 20060137700
    Abstract: Hot melt adhesives comprising a polar tackifier are triacetin resistant and particularly advantageous for use as a plug wrap sealing adhesive. Particularly preferred for use in the practice of the invention are hot melt adhesives comprising a rosin ester tackifier.
    Type: Application
    Filed: December 27, 2004
    Publication date: June 29, 2006
    Inventors: Lie-zhong Gong, Ingrid Cole, Abhi Narthana
  • Publication number: 20050042469
    Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
    Type: Application
    Filed: August 22, 2003
    Publication date: February 24, 2005
    Inventors: Lie-zhong Gong, Melissa Allen, Justin Mehaffy, Darshak Desai, Dale Haner, Tuyet Le
  • Publication number: 20040164134
    Abstract: High speed case and carton sealing lines for packaging articles. The carton to be packaged, i.e., filled and sealed, having disposed thereon an adhesive comprising an energy-absorbing ingredient that is capable of absorbing and reflecting radiant energy. The automated packaging machine comprises a means to reactivate an adhesive to effect sealing.
    Type: Application
    Filed: February 22, 2003
    Publication date: August 26, 2004
    Inventors: Lie-Zhong Gong, Peter D. Pierce, Justin A. Mehaffy
  • Publication number: 20040166238
    Abstract: A converting machine comprising a means for depositing a reactivatable adhesive onto a predetermined location of a stock material.
    Type: Application
    Filed: February 22, 2003
    Publication date: August 26, 2004
    Inventors: James W. Nowicki, Lie-Zhong Gong
  • Publication number: 20040164135
    Abstract: High speed case and carton sealing lines for packaging articles. The carton to be packaged, i.e., filled and sealed, having disposed thereon an adhesive comprising an energy-absorbing ingredient that is capable of absorbing and reflecting radiant energy. The automated packaging machine comprises a means to reactivate an adhesive to effect sealing.
    Type: Application
    Filed: February 22, 2003
    Publication date: August 26, 2004
    Inventors: Lie-zhong Gong, Peter D. Pierce, Justin A. Mehaffy
  • Publication number: 20040166309
    Abstract: An adhesive capable of reactivating upon exposure to radiant energy. The adhesive is pre-applied to a substrate and, when ready to use, reactivated upon exposure to short durations of radiant energy.
    Type: Application
    Filed: February 22, 2003
    Publication date: August 26, 2004
    Inventors: Lie-Zhong Gong, Justin A. Mehaffy
  • Publication number: 20040163768
    Abstract: A converting machine comprising a means for depositing a reactivatable adhesive onto a predetermined location of a stock material.
    Type: Application
    Filed: February 22, 2003
    Publication date: August 26, 2004
    Inventors: James W. Nowicki, Lie-Zhong Gong
  • Publication number: 20040045666
    Abstract: A hot melt adhesive comprising ethylene copolymers, a tackifier and wax is useful in bonding substrates made of polymer laminated paperboard. The adhesive is particularly useful in packaging applications.
    Type: Application
    Filed: September 6, 2002
    Publication date: March 11, 2004
    Inventors: Lie-Zhong Gong, James W. Nowicki, Renu Lamba, Jagruti B. Patel
  • Patent number: 6627683
    Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: September 30, 2003
    Assignee: Henkel Loctite Corporation
    Inventors: Philip T. Klemarczyk, Lie-Zhong Gong
  • Publication number: 20030041963
    Abstract: A reactivatable adhesive that may be used on high speed case and carton sealing lines contains an energy absorbing ingredient that is capable of absorbing and reflecting radiant energy.
    Type: Application
    Filed: August 20, 2001
    Publication date: March 6, 2003
    Inventors: Lie-zhong Gong, Renu Lamba, David J. Good, Justin A. Mehaffy