Abstract: A package assembly includes a photonic integrated circuit chip that includes an optical fiber attachment area. The package assembly also includes at least one optical fiber positioned within the optical fiber attachment area. The package assembly also includes a lid structure disposed over the at least one optical fiber. The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip. The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area. The package assembly also includes a package component to which the photonic integrated circuit chip is flip-chip attached after formation of the plurality of soldered connections.

Abstract: An improvement on liquid sac type brassieres including brassieres having a left cup and a right cup each of which has a sac disposed therein. The sac is comprised of two tough water-impermeable soft plastic sheets fused together to form a bag-like container for receiving a required volume of liquid. The surface of the soft plastic sheet on the inner side of the sac is provided with a plurality of finger-like soft massaging bosses. The wavy motion of the liquid inside the sacs cause the soft massaging bosses to press and massage the acupuncture points around the user's breasts to stimulate breast blood circulation and metabolism.