Abstract: An optical module includes a mechanical platform with an optical component disposed on the mechanical platform. At least one mechanical block is disposed next to both the mechanical platform and the optical component. An adhesive is disposed between the at least one mechanical block and each of the mechanical platform and the optical component so as to adhere the at least one mechanical block to each of the mechanical platform and the optical component. In some embodiments, the adhesive is not disposed between the optical component and the mechanical platform. In some embodiments, the optical component is optically aligned with at least one other optical component on the mechanical platform before the at least one mechanical block is adhered to the optical component.

Abstract: Optical fibers are disposed within v-grooves of an optical fiber attachment region of a photonic integrated chip (PIC). A structural adhesive is disposed over a first portion of the optical fibers within the optical fiber attachment region of the PIC without being disposed over a second portion of the optical fibers within the optical fiber attachment region of the PIC. An optical index matching adhesive is disposed over the second portion of the optical fibers within the optical fiber attachment region of the PIC. A buffer structure is disposed on the structural adhesive and the optical index matching adhesive as they are cured. The buffer structure is removed. The optical fibers, the structural adhesive, and the optical index matching adhesive have a collective vertical height above a top surface of the PIC that is less than a vertical height of flip-chip attachment structures on the top surface of the PIC.

Abstract: A package assembly includes a photonic integrated circuit chip that includes an optical fiber attachment area. The package assembly also includes at least one optical fiber positioned within the optical fiber attachment area. The package assembly also includes a lid structure disposed over the at least one optical fiber. The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip. The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area. The package assembly also includes a package component to which the photonic integrated circuit chip is flip-chip attached after formation of the plurality of soldered connections.

Abstract: An improvement on liquid sac type brassieres including brassieres having a left cup and a right cup each of which has a sac disposed therein. The sac is comprised of two tough water-impermeable soft plastic sheets fused together to form a bag-like container for receiving a required volume of liquid. The surface of the soft plastic sheet on the inner side of the sac is provided with a plurality of finger-like soft massaging bosses. The wavy motion of the liquid inside the sacs cause the soft massaging bosses to press and massage the acupuncture points around the user's breasts to stimulate breast blood circulation and metabolism.