Abstract: Disclosed a semiconductor deposition method and a semiconductor deposition system. The semiconductor deposition method includes providing a deposition apparatus, the deposition apparatus includes a spraying head for deposition; detecting whether a thickness defect exists in a deposited thin film or not, the thickness defect includes a thickness difference of the deposited thin film; acquiring at least one position where the thickness defect exists; and adjusting a structure of an air outlet panel in the spraying head based on the position of the thickness defect so as to adjust distances between air outlet holes in the air outlet panel and the deposited thin film.

Abstract: A spray head, a chemical vapor deposition device, and a working method of the chemical vapor deposition device are provided. The spray head includes a shell. A second end of the shell is provided with an air outlet panel, a plurality of air outlet holes are provided on a surface of the air outlet panel, and a middle portion of the surface of the air outlet panel is farther away from a first end than an edge portion.