Abstract: The present disclosure discloses a lens assembly, a camera module, and a method for assembling the same. An embodiment of the method for assembling a lens assembly includes: preparing a first lens subassembly and a second lens subassembly, the first lens subassembly including a first lens cylinder and a first lens, and the second lens subassembly including a second lens cylinder and a second lens; arranging the first lens subassembly on an optical axis of the second lens subassembly to form an imaging optical system comprising the first lens and the second lens; moving the first and the second lens subassemblies relatively along the optical axis, and matching an actually measured image plane of the optical system and a target plane; and connecting the first and the second lens subassemblies to fix a relative distance between the first and the second lens subassemblies along the optical axis.

Abstract: A multi-aperture imaging system and application thereof are provided. The multi-aperture imaging system includes a long-focal length camera module, a mid-focal length camera module and a wide-angle camera module. The long-focal length camera module has a field of view-FOV3. The mid-focal length camera module has a field of view-FOV2. The wide-angle camera module has a field of view-FOV1. They satisfy the condition of FOV1>FOV2>FOV3. Besides, a portion of the field of view area of FOV1 is covered by a portion of the field of view area of FOV2, while a portion of the field of view area of FOV2 is covered by a portion of the field of view area of FOV3, so as to enable a better zooming performance.

Abstract: A multi-aperture imaging system and application thereof are provided. The multi-aperture imaging system includes a long-focal length camera module, a mid-focal length camera module and a wide-angle camera module. The long-focal length camera module has a field of view-FOV3. The mid-focal length camera module has a field of view-FOV2. The wide-angle camera module has a field of view-FOV1. They satisfy the condition of FOV1>FOV2>FOV3. Besides, a portion of the field of view area of FOV1 is covered by a portion of the field of view area of FOV2, while a portion of the field of view area of FOV2 is covered by a portion of the field of view area of FOV3, so as to enable a better zooming performance.

Abstract: The present application provides an optical camera lens, comprising: a first camera lens component including at least one first camera lens; a second camera lens component including a second lens barrel and at least one second lens mounted in the second lens barrel, the at least one first lens and the at least one second lens together constitute an imageable optical system, and the at least one first lens and the at least one second lens have at least one free-form surface lens; and a connecting medium adapted to fix the first camera lens component and the second camera lens component together. This application also provides a corresponding camera module, an aseembly method of the optical camera lens and the camera module.

Abstract: Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.

Abstract: The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.

Abstract: The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.

Abstract: Disclosed are a split lens assembly and a camera module. The split lens assembly comprises a first lens module and a second lens module. The first lens module is assembled to the second lens module. The first lens module and the second lens module are calibrated and assembled. A spacing that facilitates calibration is located between the first lens module and the second lens module.

Abstract: A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.

Abstract: Disclosed is a welding structure (20) for an optical module (300) and an application thereof, wherein the optical module (300) comprises at least a first module assembly and at least a second module assembly, the welding structure (20) comprises at least a first welding part (21) and at least a second welding part (22), wherein the welding part (21) is provided on the first module assembly and the second welding part (22) is provided on the second module assembly, and after the first welding part (21) is welded to the second welding part (22), the first module assembly and the second module assembly are fixed relative to each other.

Abstract: The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.

Abstract: The present disclosure discloses a lens assembly, a camera module, and a method for assembling the same. An embodiment of the method for assembling a lens assembly includes: preparing a first lens subassembly and a second lens subassembly, the first lens subassembly including a first lens cylinder and a first lens, and the second lens subassembly including a second lens cylinder and a second lens; arranging the first lens subassembly on an optical axis of the second lens subassembly to form an imaging optical system comprising the first lens and the second lens; moving the first and the second lens subassemblies relatively along the optical axis, and matching an actually measured image plane of the optical system and a target plane; and connecting the first and the second lens subassemblies to fix a relative distance between the first and the second lens subassemblies along the optical axis.

Abstract: The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.