Abstract: A lighting apparatus having a light source, a wavelength converter, a transmission adjustor and a circuit is disclosed. The transmission adjustor is optically coupled between the light source and the wavelength converter to control an amount of light from the first light source entering the wavelength converter. In another embodiment, a lighting apparatus with a light source, first and second wavelength converters, first and second transmission attenuators, and a circuit is disclosed. The color point of the lighting apparatus is controlled through the first and second transmission attenuators. In yet another embodiment, a lighting fixture having a body with an aperture, a light source, a first transmission adjustor, and a wavelength converter is disclosed. The lighting fixture may have an additional aperture with additional wavelength converter and additional transmission adjustor.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: A package for multiple light sources is described. The package includes a plurality of light sources aligned along a first axis and a lens substantially encapsulating the plurality of light source. The lens is designed as a mono-optical lens meaning that a radius of curvature is only created along the first axis of the lens. The lens includes substantially no radius of curvature along a second axis that is perpendicular to the first axis.

Abstract: In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.

Abstract: A lighting apparatus having a light source, a wavelength converter, a transmission adjustor and a circuit is disclosed. The transmission adjustor is optically coupled between the light source and the wavelength converter to control an amount of light from the first light source entering the wavelength converter. In another embodiment, a lighting apparatus with a light source, first and second wavelength converters, first and second transmission attenuators, and a circuit is disclosed. The color point of the lighting apparatus is controlled through the first and second transmission attenuators. In yet another embodiment, a lighting fixture having a body with an aperture, a light source, a first transmission adjustor, and a wavelength converter is disclosed. The lighting fixture may have an additional aperture with additional wavelength converter and additional transmission adjustor.

Abstract: In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.

Abstract: A lighting package is disclosed. The lighting package is disclosed as including a primary light source, such as a Light Emitting Diode, and an additional electrical component that protects the primary light source from electrostatic discharge, for example. The additional electrical component may correspond to a Zener diode and may be treated with at least one material that helps reduce the light absorption of the Zener diode.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: Embodiments of light sources are disclosed herein. An embodiment of the light source comprises a lead frame having a first side and a second side. A hole extends through the lead frame between the first side and the second side. An adhesive is located in the hole and extends beyond the hole, wherein the adhesive extends beyond the diameter of the hole on the first side and the second side of the first lead frame. A light emitter adhered to the adhesive proximate the first side of the first lead frame.

Abstract: A light source is described herein. An embodiment of the light source comprises a mounting surface and a first lead frame. The first lead frame extends from the mounting surface. The first lead frame comprises a first portion extending from the mounting surface; a cup portion having a cup portion first side and a cup portion second side, the cup portion first side configured to receive a light-emitting diode, the cup portion second side being located opposite the cup portion first side; and a second portion extending between the first portion and the cup portion second side.

Abstract: An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat slug mounted on the top surface of the heat spreader, where the heat slug is made of high thermal conductive plastic.

Abstract: In an embodiment, the invention provides a PLCC package comprising first and second lead frames, a plastic structural body, a light source, an encapsulant, and an optical lens. The first lead frame comprises two tongues and a reflector cup. The first and second lead frames are attached to the plastic structural body. The light source is mounted and electrically connected at the bottom of the inside of the reflector cup. The light source is also electrically connected to the second lead frame by a wire bond. The reflector cup is surrounded on at least four sides by the encapsulant, the encapsulant having a domed portion that functions as the optical lens, the encapsulant being an integral single piece structure.

Abstract: Methods of making a light emitter are disclosed herein. An embodiment of a method comprises fabricating a line of first leads, the line of first leads comprising a plurality connected individual first leads; fabricating a line of second leads, the line of second leads comprising a plurality of connected individual second leads; physically connecting the line of first leads to the line of second leads, wherein a first individual first lead is adjacent a first individual second lead; attaching a light emitting device to the first individual first lead; electrically connecting the light emitting device to the first individual second lead; encapsulating a portion of the individual first lead and a portion of the individual second lead as a single unit; and separating the encapsulated first individual lead and the second individual lead from the first line of leads and the second line of leads.

Abstract: In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.

Abstract: An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat slug mounted on the top surface of the heat spreader, where the heat slug is made of high thermal conductive plastic.

Abstract: In an embodiment, the invention provides a light source comprising a plurality of light-emitting semiconductor chips, a plurality of electrical leads and an encapsulant. The plurality of electrical leads is connected to the plurality of light-emitting semiconductor chips. The encapsulant completely encases the plurality of semiconductor chips. The encapsulant partially encases the plurality of electrical leads.

Abstract: Embodiments of light sources are disclosed herein. An embodiment of the light source comprises a lead frame having a first side and a second side. A hole extends through the lead frame between the first side and the second side. An adhesive is located in the hole and extends beyond the hole, wherein the adhesive extends beyond the diameter of the hole on the first side and the second side of the first lead frame. A light emitter adhered to the adhesive proximate the first side of the first lead frame.