Patents by Inventor Ligui Zhou
Ligui Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150126653Abstract: Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element. Further, the dopant ink composition includes a silicon-containing compound.Type: ApplicationFiled: January 12, 2015Publication date: May 7, 2015Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Ligui Zhou, Richard A. Spear, Roger Yu-Kwan Leung, Wenya Fan, Helen X. Xu, Lea M. Metin, Anil Shriram Bhanap
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Patent number: 8975170Abstract: Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element or a Group 15 element. Further, the dopant ink composition includes a silicon-containing compound.Type: GrantFiled: October 24, 2011Date of Patent: March 10, 2015Assignee: Honeywell International Inc.Inventors: Ligui Zhou, Richard A. Spear, Roger Yu-Kwan Leung, Wenya Fan, Helen X. Xu, Lea M. Metin, Anil Shriram Bhanap
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Publication number: 20130098266Abstract: Dopant ink compositions for forming doped regions in semiconductor substrates and methods for fabricating dopant ink compositions are provided. In an exemplary embodiment, a dopant ink composition comprises a dopant compound including at least one alkyl group bonded to a Group 13 element or a Group 15 element. Further, the dopant ink composition includes a silicon-containing compound.Type: ApplicationFiled: October 24, 2011Publication date: April 25, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Ligui Zhou, Richard A. Spear, Roger Yu-Kwan Leung, Wenya Fan, Helen X. Xu, Lea M. Metin, Anil Shriram Bhanap
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Publication number: 20090141218Abstract: In the formation of color filters for flat panel displays, the invention includes concurrently curing and shrinking a pixel matrix and a color material on a substrate to achieve a substantially co-planar top surface. The invention includes applying a first activation energy to a pixel matrix material to render the material partially cured, minimally shrunk, hardened, and chemically ready for the application of a color material; applying the color material; and concurrently shrinking the color material and pixel material by the application of at least an additional activation energy wherein the additional activation energy is greater than the first activation energy. Numerous other aspects are provided.Type: ApplicationFiled: October 23, 2008Publication date: June 4, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Ligui Zhou, Quanyuan Shang
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Publication number: 20080026302Abstract: Black matrix compositions, methods for forming a black matrix, and apparatus for use in forming a color filter for a flat-panel display are disclosed. The compositions, methods and apparatus use an additive including polymerizable molecules, the polymerizable molecules each including polar portions and non-polar portions. The non-polar portions are ink-phobic and migrate toward the surface of the black matrix composition upon the surface being exposed to activation energy. The polar portions of the polymerizable molecules are ink-philic relative to the non-polar portions. Numerous other features are disclosed.Type: ApplicationFiled: April 10, 2007Publication date: January 31, 2008Inventors: Quanyuan Shang, Ligui Zhou
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Publication number: 20070065571Abstract: Apparatus and methods are provided for forming a pixel matrix. The methods include coating a substrate with a pixel matrix material, coating the pixel matrix material with an ink-phobic material, and forming pixel wells in the pixel matrix material and the ink-phobic material. A system for forming a pixel matrix is provided that includes a patterning tool including a laser ablation system operable to form pixel wells in pixel matrix material coated with ink-phobic material. The laser ablation system is operable to form pixel wells in pixel matrix material coated with ink-phobic material in an oxygenated environment so that the sidewalls of the pixel matrix are made to be ink-philic. The invention also includes a pixel well structure in which the top surfaces of the pixel well is ink-phobic and the surfaces of the sidewalls are ink-philic. Numerous other aspects are provided.Type: ApplicationFiled: September 13, 2006Publication date: March 22, 2007Inventors: John White, Quanyuan Shang, Yan Ye, Ligui Zhou
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Publication number: 20050218517Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: ApplicationFiled: May 28, 2004Publication date: October 6, 2005Applicant: M.A. CapoteInventors: Miguel Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6774493Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: March 19, 2003Date of Patent: August 10, 2004Assignee: M. A. CapoteInventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Publication number: 20030218261Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: ApplicationFiled: March 19, 2003Publication date: November 27, 2003Applicant: M. A. CapoteInventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6566234Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: September 15, 2000Date of Patent: May 20, 2003Assignee: Aguila Technologies, Inc.Inventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6518677Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: September 15, 2000Date of Patent: February 11, 2003Inventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6508910Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.Type: GrantFiled: February 27, 2001Date of Patent: January 21, 2003Assignee: Hexcel CorporationInventors: Ligui Zhou, Philippe D. Christou
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Patent number: 6440257Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.Type: GrantFiled: May 18, 2000Date of Patent: August 27, 2002Assignee: Hexcel CorporationInventors: Ligui Zhou, Philippe D. Christou
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Publication number: 20020079052Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.Type: ApplicationFiled: November 14, 2001Publication date: June 27, 2002Inventors: Ligui Zhou, Philippe D. Christou, Winston L. Hedges
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Publication number: 20010042593Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.Type: ApplicationFiled: February 27, 2001Publication date: November 22, 2001Inventors: Ligui Zhou, Philippe D. Christou
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Patent number: 6121689Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: July 21, 1998Date of Patent: September 19, 2000Assignee: Miguel Albert CapoteInventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou