Patents by Inventor LiGuo XIAO

LiGuo XIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH MODULUS COLORLESS POLYIMIDE FILM AND METHOD OF PREPARATION
    Publication number: 20230145854
    Abstract: A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (Tg) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.
    Type: Application
    Filed: January 5, 2023
    Publication date: May 11, 2023
    Inventors: YanYan JIANG, Xi REN, ZhenZhong WANG, LiGuo XIAO
  • HIGH MODULUS COLORLESS POLYIMIDE FILM AND METHOD OF PREPARATION
    Publication number: 20210095076
    Abstract: A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (Tg) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 1, 2021
    Inventors: YanYan JIANG, Xi REN, ZhenZhong WANG, LiGuo XIAO