Patents by Inventor Lih-Hsiung Chan
Lih-Hsiung Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240014277Abstract: A thin film transistor structure includes a gate electrode, a gate insulation layer, a first amorphous silicon layer, a source/drain electrode, and a second amorphous silicon layer. The gate insulation layer is located on the gate electrode. The first amorphous silicon layer is located on the gate insulation layer. The source/drain electrode is located on the first amorphous silicon layer. The second amorphous silicon layer is located in the gate insulation layer.Type: ApplicationFiled: May 25, 2023Publication date: January 11, 2024Inventors: Ming-Kai CHUANG, Lih-Hsiung CHAN
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Patent number: 11604389Abstract: A flexible display apparatus including a flexible display panel, a driving chip and a hot-melt protective layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The driving chip is disposed on the bonding area of the flexible display panel via at least one flexible circuit board. The hot-melt protective layer is disposed on the display area and a portion of the flexible circuit board. The hot-melt protective layer locates on a top surface of the flexible display panel.Type: GrantFiled: November 23, 2020Date of Patent: March 14, 2023Assignee: E Ink Holdings Inc.Inventor: Lih-Hsiung Chan
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Publication number: 20210072584Abstract: A flexible display apparatus including a flexible display panel, a driving chip and a hot-melt protective layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The driving chip is disposed on the bonding area of the flexible display panel via at least one flexible circuit board. The hot-melt protective layer is disposed on the display area and a portion of the flexible circuit board. The hot-melt protective layer locates on a top surface of the flexible display panel.Type: ApplicationFiled: November 23, 2020Publication date: March 11, 2021Applicant: E Ink Holdings Inc.Inventor: Lih-Hsiung Chan
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Patent number: 10884298Abstract: A manufacturing method of a flexible display apparatus is provided. A flexible display panel is formed on the substrate. The flexible display panel has a display area and a bonding area located outside the display area. A driving chip is bonded on the bonding area of the flexible display panel via at least one flexible circuit board. A hot-melt protective layer is formed on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board. A heating step is performed to soften the hot-melt protective layer. The flexible display panel is separated from the substrate.Type: GrantFiled: January 8, 2019Date of Patent: January 5, 2021Assignee: E Ink Holdings Inc.Inventor: Lih-Hsiung Chan
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Publication number: 20190150283Abstract: A manufacturing method of a flexible display apparatus is provided. A flexible display panel is formed on the substrate. The flexible display panel has a display area and a bonding area located outside the display area. A driving chip is bonded on the bonding area of the flexible display panel via at least one flexible circuit board. A hot-melt protective layer is formed on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board. A heating step is performed to soften the hot-melt protective layer. The flexible display panel is separated from the substrate.Type: ApplicationFiled: January 8, 2019Publication date: May 16, 2019Applicant: E Ink Holdings Inc.Inventor: Lih-Hsiung Chan
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Patent number: 9823801Abstract: A touch panel including a substrate, a plurality of first and second sensing series, and a plurality of conductive repairing pattern layers is provided. The first sensing series are disposed on the substrate and extended along a first direction. Each of the first sensing series includes a plurality of first sensing pads and first bridge lines, and the first bridge lines serially connect two adjacent first sensing pads. The second sensing series are disposed on the substrate and extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and second bridge lines, and the second bridge lines serially connect two adjacent second sensing pads. Each conductive repairing pattern layer electrically floating locates around the crossover region of the first and second sensing series. Two adjacent sensing pads are connected by the conductive repairing pattern layer after a repair procedure is finished.Type: GrantFiled: August 30, 2016Date of Patent: November 21, 2017Assignee: Au Optronics CorporationInventors: Lih-Hsiung Chan, Shine-Kai Tseng, Chin-Yueh Liao, Hung-Wen Chou
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Publication number: 20160370900Abstract: A touch panel including a substrate, a plurality of first and second sensing series, and a plurality of conductive repairing pattern layers is provided. The first sensing series are disposed on the substrate and extended along a first direction. Each of the first sensing series includes a plurality of first sensing pads and first bridge lines, and the first bridge lines serially connect two adjacent first sensing pads. The second sensing series are disposed on the substrate and extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and second bridge lines, and the second bridge lines serially connect two adjacent second sensing pads. Each conductive repairing pattern layer electrically floating locates around the crossover region of the first and second sensing series. Two adjacent sensing pads are connected by the conductive repairing pattern layer after a repair procedure is finished.Type: ApplicationFiled: August 30, 2016Publication date: December 22, 2016Applicant: Au Optronics CorporationInventors: Lih-Hsiung Chan, Shine-Kai Tseng, Chin-Yueh Liao, Hung-Wen Chou
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Patent number: 9399336Abstract: A gas barrier substrate including a flexible base material, at least one first inorganic gas barrier layer and at least one second inorganic gas barrier layer is provided. The flexible base material has an upper surface. The first inorganic gas barrier layer is disposed on the flexible base material and covers the upper surface. The second inorganic gas barrier layer is disposed on the first inorganic gas barrier layer and covers the first inorganic gas barrier layer. A water vapor and oxygen transmission rate of the second inorganic gas barrier layer is lower than that of the first inorganic gas barrier layer.Type: GrantFiled: March 15, 2013Date of Patent: July 26, 2016Assignee: E Ink Holdings Inc.Inventors: Lih-Hsiung Chan, Huai-Cheng Lin, Chih-Cheng Wang
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Publication number: 20160205781Abstract: A flexible display apparatus including a flexible display panel, a flexible circuit board, a driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.Type: ApplicationFiled: March 17, 2016Publication date: July 14, 2016Inventor: Lih-Hsiung Chan
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Patent number: 9326388Abstract: A flexible display apparatus including a flexible display panel, at least one flexible circuit board, at least one driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.Type: GrantFiled: July 25, 2013Date of Patent: April 26, 2016Assignee: E Ink Holdings Inc.Inventors: Lih-Hsiung Chan, Chu-Kuang Tseng
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Publication number: 20140158663Abstract: A surface treatment method for a flexible substrate is provided. A flexible insulation substrate is provided. A surface of the flexible insulation substrate has at least one defect. A plasma etching is performed on the flexible insulation substrate to smooth a profile of the defect.Type: ApplicationFiled: August 7, 2013Publication date: June 12, 2014Applicant: E Ink Holdings Inc.Inventors: Lih-Hsiung Chan, Huai-Cheng Lin, Ming-Sheng Chiang, Chih-Cheng Wang
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Publication number: 20140146491Abstract: A flexible display apparatus including a flexible display panel, at least one flexible circuit board, at least one driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.Type: ApplicationFiled: July 25, 2013Publication date: May 29, 2014Applicant: E Ink Holdings Inc.Inventors: Lih-Hsiung Chan, Chu-Kuang Tseng
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Publication number: 20140030494Abstract: A gas barrier substrate including a flexible base material, at least one first inorganic gas barrier layer and at least one second inorganic gas barrier layer is provided. The flexible base material has an upper surface. The first inorganic gas barrier layer is disposed on the flexible base material and covers the upper surface. The second inorganic gas barrier layer is disposed on the first inorganic gas barrier layer and covers the first inorganic gas barrier layer. A water vapor and oxygen transmission rate of the second inorganic gas barrier layer is lower than that of the first inorganic gas barrier layer.Type: ApplicationFiled: March 15, 2013Publication date: January 30, 2014Applicant: E INK HOLDINGS INC.Inventors: Lih-Hsiung Chan, Huai-Cheng Lin, Chih-Cheng Wang
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Patent number: 8314423Abstract: A thin film transistor array substrate and a manufacturing method thereof are provided. In the manufacturing method, a first patterned conductive layer including a plurality of scan lines and a plurality of gates connected with the scan lines is formed on a substrate. A patterned gate insulating layer having a plurality of openings is then formed on the substrate to cover at least a portion of the first patterned conductive layer, and a plurality of dielectric patterns are formed in the openings. A plurality of semiconductor patterns are formed on the patterned gate insulating layer. A second patterned conductive layer is formed on the semiconductor patterns, the patterned gate insulating layer, and the dielectric patterns. A passivation layer is formed on the semiconductor patterns, the patterned gate insulating layer, and the dielectric patterns. A plurality of pixel electrodes are formed on the passivation layer.Type: GrantFiled: September 16, 2009Date of Patent: November 20, 2012Assignee: Au Optronics CorporationInventors: Chien-Hung Chen, Lih-Hsiung Chan, Chin-Yueh Liao, Hsien-Kai Tseng
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Publication number: 20120081300Abstract: A touch panel including a substrate, a plurality of first and second sensing series, and a plurality of conductive repairing pattern layers is provided. The first sensing series are disposed on the substrate and extended along a first direction. Each of the first sensing series includes a plurality of first sensing pads and first bridge lines, and the first bridge lines serially connect two adjacent first sensing pads. The second sensing series are disposed on the substrate and extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and second bridge lines, and the second bridge lines serially connect two adjacent second sensing pads. Each conductive repairing pattern layer electrically floating locates around the crossover region of the first and second sensing series. Two adjacent sensing pads are connected by the conductive repairing pattern layer after a repair procedure is finished.Type: ApplicationFiled: December 17, 2010Publication date: April 5, 2012Applicant: AU OPTRONICS CORPORATIONInventors: Lih-Hsiung Chan, Shine-Kai Tseng, Chin-Yueh Liao, Hung-Wen Chou
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Publication number: 20100320466Abstract: A thin film transistor array substrate and a manufacturing method thereof are provided. In the manufacturing method, a first patterned conductive layer including a plurality of scan lines and a plurality of gates connected with the scan lines is formed on a substrate. A patterned gate insulating layer having a plurality of openings is then formed on the substrate to cover at least a portion of the first patterned conductive layer, and a plurality of dielectric patterns are formed in the openings. A plurality of semiconductor patterns are formed on the patterned gate insulating layer. A second patterned conductive layer is formed on the semiconductor patterns, the patterned gate insulating layer, and the dielectric patterns. A passivation layer is formed on the semiconductor patterns, the patterned gate insulating layer, and the dielectric patterns. A plurality of pixel electrodes are formed on the passivation layer.Type: ApplicationFiled: September 16, 2009Publication date: December 23, 2010Applicant: AU OPTRONICS CORPORATIONInventors: Chien-Hung Chen, Lih-Hsiung Chan, Chin-Yueh Liao, Hsien-Kai Tseng
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Publication number: 20100144085Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).Type: ApplicationFiled: January 26, 2010Publication date: June 10, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Lih-Hsiung Chan, Ming-Chun Hsiao, Wei-Ling Lin, Gary Wei
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Patent number: 7728502Abstract: A method for fabricating a cathode plate of a field emission display is disclosed. A patterned electrode layer is formed on a surface of the substrate, and emitters for absorbing a light source are formed on the patterned electrode layer. Next, a dielectric layer is formed over the substrate, and a patterned gate layer is formed on the dielectric layer. Thereafter, a backside exposure process is carried out using the emitters as a mask, and portions of the dielectric layer not masked by the emitters react with a light used in the backside exposure process. Next, portions of the dielectric layer not exposed to the light and portions of the gate layer are removed to form via holes and gate holes.Type: GrantFiled: March 21, 2006Date of Patent: June 1, 2010Assignee: Industrial Technology Research InstituteInventors: Liang-You Jiang, Yu-Yang Chang, Lih-Hsiung Chan
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Patent number: 7679081Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).Type: GrantFiled: January 22, 2007Date of Patent: March 16, 2010Assignee: Industrial Technology Research InstituteInventors: Lih-Hsiung Chan, Ming-Chun Hsiao, Wei-Ling Lin, Gary Wei
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Publication number: 20090246384Abstract: Coating apparatuses and methods for coating patterned film using the same are presented. The coating apparatus includes a stage, arranged to support a substrate. A stencil is included having patterned openings, wherein the patterned openings are desired film printed patterns. A squeegee set is included, including a scraper and an auxiliary nozzle, wherein the scraper serves as a spreading device and spreads paste on the stencil and fills paste into the patterned openings, and wherein the auxiliary nozzle exerts a force on the paste in the patterned openings to transfer the paste onto the substrate.Type: ApplicationFiled: December 1, 2008Publication date: October 1, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jane-Hway Liao, Lih-Hsiung Chan, Liang-You Jiang, Kuang-Chung Chen