Patents by Inventor Lih Lin
Lih Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7428153Abstract: A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.Type: GrantFiled: July 13, 2006Date of Patent: September 23, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Li-Kuang Tan, Yeu-Lih Lin, Tseng-Hsiang Hu
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Patent number: 7414842Abstract: A heat dissipation device includes a heat sink with a plurality of fins, a fan mounted on a side of the heat sink with a space formed between the heat sink and the fan, and at least one airflow guiding board formed by one end of at least one of the fins. The airflow guiding board extends through the space to connect with the fan. The airflow guiding board can guide the airflow generated by the fan to the heat sink, so as to reduce the loss of the airflow from the edge of the heat sink, and enhance the effect of heat dissipation. Alternatively, the airflow guide board can also function to guide the airflow to cool other heat sinks.Type: GrantFiled: April 24, 2006Date of Patent: August 19, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ming-Liang Hao, Ming Yang, Chin-Lung Chen, Yeu-Lih Lin
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Publication number: 20080191948Abstract: An antenna device (10) of a consumer electronic product is formed on an outer surface (302) of a shell (30) of the electronic product. The shell of the consumer electronic product is adapted for forming an enclosure of an electronic product. The antenna device extends on a planar plane and is integrally formed with and is coated on the outer surface of the shell. A method for making the antenna device includes: (A) providing a consumer electronic product having a shell for forming the antenna device on an outer surface thereof, the shell being adapted for enclosing components of the consumer electronic product therein; (B) coating a copper layer on the outer surface of the shell of the electronic product; (C) forming circuitry out of the copper layer to form the antenna device.Type: ApplicationFiled: March 22, 2007Publication date: August 14, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TSENG-HSIANG HU, LI-KUANG TAN, YEU-LIH LIN
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Publication number: 20080175008Abstract: A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.Type: ApplicationFiled: January 23, 2007Publication date: July 24, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TSENG-HSIANG HU, YEU-LIH LIN, LI-KUANG TAN
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Publication number: 20080158887Abstract: A light-emitting diode (LED) includes a heat sink (10) having a cross section along an axial direction thereof being U-shaped. The heat sink includes a substrate (102) and a sidewall (11) extending from an outer periphery of the substrate. A circuit board (40) is received in the heat sink and arranged on the substrate. At least one LED (30) is arranged on and electrically connected to the circuit board and thermally connected with the substrate of the heat sink. A plurality of fins (100) extend outwardly from an outer surface (110) of the sidewall of the heat sink. Each fin has a plurality of branches (100a, 100b) being connected together at the outer surface of the sidewall and being spaced from each other at outer-peripheries thereof.Type: ApplicationFiled: February 13, 2007Publication date: July 3, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Ming-Wu Zhu, Li-Kuang Tan, Yeu-Lih Lin, Tseng-Hsiang Hu
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Publication number: 20080157100Abstract: A light emitting diode (LED) assembly includes at least an LED (102), a substrate (20), a heat dissipation apparatus (40) and at least one securing frame (30). The substrate forms a set of electrical circuitry (22) thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion (32) securing the substrate with the heat dissipation apparatus detachably.Type: ApplicationFiled: March 16, 2007Publication date: July 3, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: LI-KUANG TAN, YEU-LIH LIN, TSENG-HSIANG HU
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Publication number: 20080105735Abstract: An assembly includes an electronic product (40), and a packaging box (10) for enclosing the electronic product therein. The packaging box includes a casing (12) and a cover (14). The casing includes a base wall (124) and four sidewalls (120, 121, 122, 123) disposed around the base wall. An accommodating space (125) is defined between the base wall and the sidewalls for enclosing an electronic product therein. Two opposite first sidewalls (120, 121) of the casing have two side plates (16) pivotably extending therefrom. The side plates include a plurality of projections (162, 164) extending towards the accommodating space for cushioning the electronic product. The cover is pivotably extended from a second sidewall (123) connected with the first sidewalls of the casing and covers the accommodating space.Type: ApplicationFiled: November 3, 2006Publication date: May 8, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TONG-HUA LIN, YEU-LIH LIN, CHIN-LUNG CHEN
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Publication number: 20080105408Abstract: A heat-pipe type heat sink (100) includes a plurality of fins (10), at least a heat pipe (20) extending through the fins, and soldering material (40) disposed between the heat pipe and the fins. Each of the fins defines therein a through hole (12) and a cutout (13) adjacent to the through hole. A sidewall of the through hole forms a collar (122) contacting with the heat pipe, whilst a sidewall of the cutout forms at least a fringe (132) connecting with the collar. The fringe guides the soldering material in molten state to flow from the cutout towards the collar to fill in a gap formed between the heat pipe and the fins to bond the heat pipe and the fins together after the molten soldering material is cooled.Type: ApplicationFiled: November 3, 2006Publication date: May 8, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: JING ZHANG, YEU-LIH LIN, CHIN-LUNG CHEN, MING-LIANG HAO, MING YANG
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Publication number: 20080099186Abstract: A flexible heat pipe (10) includes a casing (12), a wick structure (20) arranged in the casing, and a working medium saturated in the wick structure. The casing includes an evaporation section (122), a condensation section (126), and a flexible adiabatic section (124) connecting the evaporation section with the condensation section. The wick structure includes a first portion (21), a second portion (23) and a third portion respectively disposed in the evaporation, the condensation and the adiabatic sections of the casing. The adiabatic section of the casing further accommodates a supporting member (30) therein for supporting the third portion of the wick structure to have an intimate contact with an inner surface of the adiabatic section.Type: ApplicationFiled: March 15, 2007Publication date: May 1, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Fang-Xiang Yu, Yeu-Lih Lin
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Patent number: 7365983Abstract: A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, two wings (144) extending from two opposite sides of the main body, and a plurality of projections (148) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.Type: GrantFiled: November 3, 2005Date of Patent: April 29, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Shu-Liang Huang, Yeu-Lih Lin, Ai-Min Huang, Ming Yang
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Publication number: 20080085088Abstract: The present invention relates to an assembly of multiple waveguides which includes a substrate and a plurality of waveguides positioned on said substrate at locations effective to suppress cross-talk between different waveguides. The plurality of waveguides each comprise an elongate array of quantum dots extending between sets of first and second locations on the substrate. The waveguides are positioned to receive: (1) pumped light uniformly applied to the array to produce electron-hole pairs and to enable optical gain and (2) signal light at the first location to trigger an emission from the quantum dot at the first location and transmission of photons along the array to the second location. A light transmission system which includes this assembly as well as methods of making and using the assembly are also disclosed.Type: ApplicationFiled: May 18, 2007Publication date: April 10, 2008Applicant: UNIVERSITY OF WASHINGTONInventors: Lih Lin, Chia-Jean Wang, Babak Parvis
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Patent number: 7292442Abstract: A heat sink clip and an assembly incorporating such clip are provide. The heat sink clip comprises: a body, an actuating member and a movable fastener. The body has a securing portion formed at one end thereof. The actuating member has a hinge portion thereof. The movable fastener is secured to the hinge portion of the actuating member. The actuating member is pivotably mounted to the securing portion of the body in a direction substantially perpendicular to the body, and the actuating member is turnable relative to the body between a locked position and an unlocked position.Type: GrantFiled: April 24, 2006Date of Patent: November 6, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Fang-Xiang Yu, Yeu-Lih Lin, Ming Yang
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Publication number: 20070210385Abstract: ESD protection devices without current crowding effect at the finger's ends. It is applied under MM ESD stress in sub-quarter-micron CMOS technology. The ESD discharging current path in the MMOS or PMOS device structure is changed by the proposed new structures, therefore the MM ESD level of the NMOS and PMOS can be significantly improved. In this invention, 6 kinds of new structures are provided. The current crowding problem can be successfully solved, and have a higher MM ESD robustness. Moreover, these novel devices will not degrade the HBM ESD level and are widely used in ESD protection circuits.Type: ApplicationFiled: February 28, 2007Publication date: September 13, 2007Inventors: Ming-Dou Ker, Geeng-Lih Lin, Hsin-Chyh Hsu
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Patent number: 7254026Abstract: A heat dissipation device (40) includes at least a heat pipe (45) and a plurality of metal fins (43) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (431). An extension flange (433) extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (435). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.Type: GrantFiled: March 20, 2006Date of Patent: August 7, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ming Yang, Yeu-Lih Lin, Chin-Lung Chen
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Patent number: 7249626Abstract: A heat dissipation device includes a fin unit (50), and at least a heat pipe (30) including an evaporating section (32) and at least a condensing section (34) extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a V-shaped section (52,53) and a planar section (54) therebetween. The wavy and V-shaped sections of the fins can guide an airflow flowing into the fin unit to smoothly flow therethrough, and prevent escape of the airflow from lateral directions of the fin unit. Furthermore, the wavy and V-shaped sections increase the heat dissipation area of the fins and strengthen the fins.Type: GrantFiled: December 25, 2005Date of Patent: July 31, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ming-Liang Hao, Yeu-Lih Lin, Ai-Min Huang, Ming Yang
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Publication number: 20070152275Abstract: ESD protection devices without current crowding effect at the finger's ends. It is applied under MM ESD stress in sub-quarter-micron CMOS technology. The ESD discharging current path in the NMOS or PMOS device structure is changed by the proposed new structures, therefore the MM ESD level of the NMOS and PMOS can be significantly improved. In this invention, 6 kinds of new structures are provided. The current crowding problem can be successfully solved, and have a higher MM ESD robustness. Moreover, these novel devices will not degrade the HBM ESD level and are widely used in ESD protection circuits.Type: ApplicationFiled: February 28, 2007Publication date: July 5, 2007Inventors: Ming-Dou Ker, Geeng-Lih Lin, Hsin-Chyh Hsu
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Publication number: 20070145418Abstract: ESD protection devices without current crowding effect at the finger's ends. It is applied under MM ESD stress in sub-quarter-micron CMOS technology. The ESD discharging current path in the NMOS or PMOS device structure is changed by the proposed new structures, therefore the MM ESD level of the NMOS and PMOS can be significantly improved. In this invention, 6 kinds of new structures are provided. The current crowding problem can be successfully solved, and have a higher MM ESD robustness. Moreover, these novel devices will not degrade the HBM ESD level and are widely used in ESD protection circuits.Type: ApplicationFiled: February 28, 2007Publication date: June 28, 2007Inventors: Ming-Dou Ker, Geeng-Lih Lin, Hsin-Chyh Hsu
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Publication number: 20070131805Abstract: An electrostatic spraying device has a capability of confirming that the device is ready for making an electrostatic spraying of the liquid composition on a user's skin. The device includes a nozzle and a pump for dispensing the liquid composition out through the nozzle. An emitter electrode is disposed to electrostatically charge the liquid composition being dispensed for making the electrostatic spraying. The device is provided with a power switch and a selector for selection between a spraying mode and a dripping mode. In the dripping mode, the pump is alone actuated to dispense the liquid composition absent electrostatic charge. In the spraying mode, both of the pump and the emitter electrode are activated to make the electrostatic spraying. Thus, the user can be easy to drip the liquid composition by simply manipulating the selector prior to initiating the electrostatic spraying.Type: ApplicationFiled: November 26, 2004Publication date: June 14, 2007Applicants: MATSUSHITA ELECTRIC WORKS, LTD., THE PROCTER & GAMBLE COMPANYInventors: Naoki Yamaguchi, Koji Asakawa, David Wilson, Kazumi Toyama, Meei-Lih Lin
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Publication number: 20070132092Abstract: An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.Type: ApplicationFiled: July 20, 2006Publication date: June 14, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TSENG-HSIANG HU, YEU-LIH LIN, LI-KUANG TAN
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Publication number: 20070121301Abstract: A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.Type: ApplicationFiled: July 13, 2006Publication date: May 31, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: LI-KUANG TAN, YEU-LIH LIN, TSENG-HSIANG HU