Abstract: Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

Abstract: A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.

Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 125° C., the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.

Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.

Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.

Abstract: Disclosure are films based on alkoxysilane-containing polyolefin resins with reduced melt strength, photovoltaic cell laminate structures and methods for their preparation. In the disclosed alkoxysilane-containing polyolefin resin films according to the invention, reduced melt strength is provided by, among other things, using optimized silane:initiator ratios and is shown to reduce detrimental film shrinkage and provide improved photovoltaic laminate structures.

Abstract: The backsheet comprises a coextruded multilayer sheet that comprises: i) an inner layer comprising a polyolefin resin; ii) a core layer comprising a polypropylene resin, a blend of a polypropylene resin and a maleic anhydride grafted polypropylene (MAH-g-PP), or a polypropylene resin/MAH-g-PP multilayer structure; iii) an outer layer comprising a maleic anhydride grafted polyvinylidene fluoride (MAH-g-PVDF), a blend of a polyvinylidene fluoride (PVDF) and a MAH-g-PVDF, or a PVDF/MAH-g-PVDF multilayer structure; iv) a first tie layer between the core layer and the outer layer; and v) an optional second tie layer between the core layer and the inner layer.

Abstract: Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.

Abstract: The backsheet comprises a coextruded multilayer sheet that comprises: i) an inner layer comprising a polyolefin resin; ii) a core layer comprising a polypropylene resin, a blend of a polypropylene resin and a maleic anhydride grafted polypropylene (MAH-g-PP), or a polypropylene resin/MAH-g-PP multilayer structure; iii) an outer layer comprising a maleic anhydride grafted polyvinylidene fluoride (MAH-g-PVDF), a blend of a polyvinylidene fluoride (PVDF) and a MAH-g-PVDF, or a PVDF/MAH-g-PVDF multilayer structure; iv) a first tie layer between the core layer and the outer layer; and v) an optional second tie layer between the core layer and the inner layer.

Abstract: The present invention is directed to a multilayer polymer film for application to and removal from a substrate, having controlled surface adhesion and peelably removable from a surface, the film having a layer comprising components (A) at least one polyolefin, (B) an adhesive composition in an amount equal to or greater than 3 weight percent, (C) a tackifier composition in an amount of from 1 to 12 weight percent, (D) at least one colorant in an amount from 0 to 15 weight percent, (E) anti-block additive in an amount of less than 1 weight percent, and (F) roughening material in an amount of less than or equal to 20 weight percent, each based on total weight of the adhesive layer; the components (A) through (F) with optional incidental carriers and additives being 100 percent by weight of the adhesive layer; wherein the adhesive composition consists essentially of ethylene/methyl acrylate and ethylene/acrylic acid in a weight ratio of from 60:40 to 50:15, that is, 77:23, ethylene/methyl acrylate to ethylene/ac

Abstract: The present invention is directed to a polymer film comprising a roughening material. The polymer film comprises a base polyolefin, and a roughening material present in an amount of equal to or greater than about 3 weight percent, based on total weight of the polymer film, wherein the roughening material has an average particle size ranging from about 20 to about 60 microns. A multilayer film including an adhesive layer and the polymer film is also disclosed.

Abstract: Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.