Abstract: A photovoltaic cell with resonance cavity is provided. A first structure of reflection is attached toward one side of the resonance cavity and configured for reflecting light beams from the resonance cavity. The second structure of reflection is attached toward other side of the resonance cavity and configured for reflecting light beams from exterior and the resonance cavity. Thus, photos will be absorbed efficiently within the resonance cavity and converted into electrons.

Abstract: The present invention provides a structure of a metal-insulator-semiconductor (MIS)-like multiple-negative-differential-resistance (MNDR) device and the fabrication method thereof. The device of the present invention has the characteristics of dual-route and MNDR at low temperatures. These characteristics result from the successive barrier-lowering and potential-redistribution effect when conducting carriers fall into a quantum well. MNDR devices have excellent potential in multiple-value logic circuitry applications and are capable of reducing circuitry complexity.

Abstract: The present invention is a fabrication process and structure of a negative-differential-resistance device characterized by triple negative-differential-resistance at room temperature and hexad negative-differential-resistance at a low temperature (−105° C.). The component parts are, from bottom upward, a substrate made of GaAs material, a first layer made of GaAs material, a second layer made of InGaAs (InxGa1−xAs) material, a third layer made of AlGaAs material, and a metallic coating by vaporization on the third layer. Of the three layers, the second one is a varied layer composed of our successively varied laminates. The device, by utilizing the successive carriers accumulations of step-graded InGaAs subwells and the barrier lowering effect, provides MNDR properties and good potential for multiple-valued logic circuit applications.

Abstract: The present invention provides a GaInP/GaInAs/GaAs modulation-compositioned channel field-effect transistor which comprises: a substrate of semi-insulated GaAs material; a first layer of non-doped GaAs material, formed on the substrate; a second layer of n-doped GaInAs material, formed on the first layer; a third layer of non-doped GaInP material, formed on the second layer; a fourth layer of n-doped GaAs material, formed on the third layer; an Au layer, formed on the third layer; and an Au/Ge/Ni alloy layer, formed on the fourth layer. An accumulation effect is performed because there is a V-shaped energy band existing in the modulation-compositioned channel. Therefore, the transistor of the present invention is characterized by a large current density, a large gate voltage swing with high transconductance, and a high gate breakdown voltage. The present invention has a good potentiality for high-speed, high-power, and large input signal circuit applications.

Abstract: The present invention provides a structure of a metal-insulator-semiconductor (MIS)-like multiple-negative-differential-resistance (MNDR) device and the fabrication method thereof. The device of the present invention has the characteristics of dual-route and MNDR at low temperatures. These characteristics result from the successive barrier-lowering and potential-redistribution effect when conducting carriers fall into a quantum well. MNDR devices have excellent potential in multiple-value logic circuitry applications and are capable of reducing circuitry complexity.

Abstract: A pseudomorphic step-doped-channel field-effect transistor is provided, which has advantages of large transconductance, high electron mobility, high gate voltage swing and high current density, and can increase the pinch-off voltage tolerance. Thus the pseudomorphic step-doped-channel field-effect transistor is suitable for high-speed, high-power, and large-input signal circuitry systems. The pseudomorphic step-doped-channel field-effect transistor comprises: a semi-insulating GaAs substrate; an undoped GaAs layer formed on the GaAs substrate to serve as a buffer layer; an n-doping InGaAs layer formed on the undoped GaAs layer to serve as a channel layer; an undoped AlGaAs layer formed on the n-doping InGaAs layer to serve as a Schottky contact layer; an n-doping GaAs layer formed on the undoped AlGaAs layer; and metal layers formed on the undoped AlGaAs layer and the n-doping GaAs layer to respectively serve as a gate, a drain and a source of the pseudomorphic step-doped-channel field-effect transistor.