Abstract: An adapter, including a socket body, a guiding body, a movable conducting strip and a control member. The guiding body and the movable conducting strip are both disposed on one side of the socket body facing away from jacks, the control member is connected to the movable conducting strip in a transmission fashion, and is configured to drive the movable conducting strip to rotate relative to the socket body.

Abstract: A method for manufacturing an optical element is a method for manufacturing an optical element in which laser light is transmitted, reciprocated, or reflected, and the method includes a first step of obtaining a bonded element formed by subjecting a first element part and a second element part, both being transparent to laser light, to surface activated bonding with a non-crystalline layer interposed therebetween; and after the first step, a second step of crystallizing at least a portion of the non-crystalline layer by raising the temperature of the bonded element. In the second step, the temperature of the bonded element is raised to a predetermined temperature that is lower than the melting points of the first element part and the second element part.

Abstract: A method for manufacturing an optical element is a method for manufacturing an optical element in which laser light is transmitted, reciprocated, or reflected, and the method includes a first step of obtaining a bonded element formed by subjecting a first element part and a second element part, both being transparent to laser light, to surface activated bonding with a non-crystalline layer interposed therebetween; and after the first step, a second step of crystallizing at least a portion of the non-crystalline layer by raising the temperature of the bonded element. In the second step, the temperature of the bonded element is raised to a predetermined temperature that is lower than the melting points of the first element part and the second element part.

Abstract: A laser processing device according an embodiment is a laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process. The laser processing device includes: a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; and an accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit. A pulse width of the pulsed laser light is 200 ps to 2 ns, and the pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port.

Abstract: A laser component is provided, including a laser medium and a transparent heat transmitting member, at least one of which is oxide. Bonding surfaces of the laser medium and the transparent heat transmitting member are exposed to oxygen plasma, and thereafter the bonding surfaces are brought into contact without heating. The laser medium and the transparent heat transmitting member are bonded at atomic levels, their thermal resistance is low, and no large residual stress is generated due to the bonding taking place under normal temperature. The process of oxygen plasma exposure ensures transparency of their bonding interface. The laser medium and the transparent heat transmitting member are stably bond via an amorphous layer.

Abstract: A laser component is provided, including a laser medium and a transparent heat transmitting member, at least one of which is oxide. Bonding surfaces of the laser medium and the transparent heat transmitting member are exposed to oxygen plasma, and thereafter the bonding surfaces are brought into contact without heating. The laser medium and the transparent heat transmitting member are bonded at atomic levels, their thermal resistance is low, and no large residual stress is generated due to the bonding taking place under normal temperature. The process of oxygen plasma exposure ensures transparency of their bonding interface. The laser medium and the transparent heat transmitting member are stably bond via an amorphous layer.

Abstract: Provided is a passive Q-switch laser device possessing a power density controller (15) making power density of excitation light from an excitation light source (14) equal to or greater than power density so that delay time required for reaching oscillation after start of excitation of a laser gain medium (12) becomes equal to or shorter than a laser upper energy level lifetime of the laser gain medium (12).

Abstract: A technique which is suitable in joining an end surface of a laser medium to a transparent heat sink for maintaining thermal resistance therebetween low and avoiding large thermal stress from acting on the laser medium is to be provided. An end coat is provided on the end surface of the laser medium, a same-material layer constituted of a same material as the heat sink is provided on a surface of the end coat, a surface of the same-material layer and an end surface of the heat sink are activated in a substantially vacuum environment, and those activated surfaces are bonded in the substantially vacuum environment. A laser apparatus having low thermal resistance between the laser medium and the heat sink and high transparency at a joint interface therebetween, and no large thermal stress acting on the laser medium is thereby obtained.

Abstract: Provided is a passive Q-switch laser device possessing a power density controller (15) making power density of excitation light from an excitation light source (14) equal to or greater than power density so that delay time required for reaching oscillation after start of excitation of a laser gain medium (12) becomes equal to or shorter than a laser upper energy level lifetime of the laser gain medium (12).