Patents by Inventor Li-Hsuan Chou

Li-Hsuan Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package device
    Patent number: 12230558
    Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: February 18, 2025
    Assignee: InnoLux Corporation
    Inventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
  • Notebook computer
    Patent number: D770440
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: November 1, 2016
    Assignee: Acer Incorporated
    Inventor: Li-Hsuan Chou