Patents by Inventor Lihu HOU

Lihu HOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
    Publication number: 20250149419
    Abstract: A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.
    Type: Application
    Filed: January 10, 2025
    Publication date: May 8, 2025
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yushuang YAO, Qing YANG, Lihu HOU
  • HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
    Publication number: 20210265248
    Abstract: A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 26, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yushuang YAO, Qing YANG, Lihu HOU