Abstract: An electrode extension assembly is for a vacuum switching apparatus, such as a vacuum interrupter, including a vacuum envelope and separable contact assemblies. Each contact assembly includes a contact disposed in the interior of the vacuum envelope, and an electrode stem extending outwardly from the contact to the exterior of the vacuum envelope. The electrode extension assembly includes a number of extension members each being be joined to the electrode stem of a corresponding one of the contact assemblies on the exterior of the vacuum envelope by a welded joint formed by electron beam welding or plasma welding.

Abstract: An electrode extension assembly is for a vacuum switching apparatus, such as a vacuum interrupter, including a vacuum envelope and separable contact assemblies. Each contact assembly includes a contact disposed in the interior of the vacuum envelope, and an electrode stem extending outwardly from the contact to the exterior of the vacuum envelope. The electrode extension assembly includes a number of extension members each being be joined to the electrode stem of a corresponding one of the contact assemblies on the exterior of the vacuum envelope by a welded joint formed by electron beam welding or plasma welding.

Abstract: The invention is provided with a contact system (25) which comprises a first conductor (5) with a radial contact surface (6, 6?), a second conductor (8) with an axial contact surface (7) and a contact member (24) mounted on the first conductor (5) in radially displaceable mode relative to the first conductor (5). The contact member (24) comprises a first contact portion (15) and a second contact portion (16) electrically connected to each other. The first contact portion (15) of the contact member (24) contacts with the radial contact surface (6, 6?) of the first conductor (5) and is radially movable relative to the first conductor (5), and the second contact portion (16) of the contact member (24) contacts with the axial contact surface (7) of the second conductor (8) and is axially movable relative to the second conductor (8).

Abstract: A preparation process of wafer level chip scale packaging that prevents damaging a wafer in molding process is disclosed. In this process, a grinding grove is formed at a top side and around the edge of a wafer before molding is performed. The grinding groove effectively prevents the molding material from overflowing to the edge of the wafer, which avoids the damage of the wafer.

Abstract: A semiconductor packaging process with improved die attach method for ultrathin chips package comprises the steps of providing a semiconductor wafer having a wafer frontside and a wafer backside with a plurality of integrated circuit chips (IC chips) formed on the wafer frontside; adhering a supporting substrate onto the wafer frontside through a bonding layer to form a wafer combo; grinding the wafer backside with the supporting substrate and the wafer bonded together; dicing the wafer combo into a plurality of die combos each comprising a substrate piece stacked on top of an IC chip bonded by a bonding layer piece; attaching a die combo onto a die pad of a lead frame with a bottom of the IC chip connected to the lead frame thereof; and removing the substrate piece with the bonding layer piece from the top surface of the IC chip.