Abstract: A package structure is provided. The package structure includes a redistribution structure on a substrate, a semiconductor die on the redistribution structure and electrically connected to the substrate, a wall structure on the redistribution structure and electrically isolated from the substrate. The semiconductor die includes a first sidewall, a second sidewall connected to the first sidewall, and a third sidewall connected to the second sidewall. The wall structure includes a first partition, a second partition and a third partition respectively immediately adjacent to the first sidewall, the second sidewall, and the third sidewall of the semiconductor die. The first partition is located immediately adjacent to and spaced apart from the second partition by a first distance, the second partition is located immediately adjacent to and spaced apart from the third partition by a second distance, and the first distance is substantially equal to the second distance.

Abstract: A temperature-sensitive cell culture composition is provided. The temperature-sensitive cell culture composition includes a hydrogel, a cellulose, a gelatin and a collagen. Based on 1 part by weight of the collagen, a content of the hydrogel is between 0.03 parts by weight and 60 parts by weight, a content of the cellulose is between 150 parts by weight and 360 parts by weight, and a content of the gelatin is between 21 parts by weight and 12 parts by weight. In addition, a method for using the temperature-sensitive cell culture composition, a method for forming the temperature-sensitive cell culture composition, and a use of the temperature-sensitive cell culture composition are also provided.

Abstract: A power generator driving device utilizing tides to form a liquid piston comprises a fixed upside-down lid container, the container mouth is immersed in the seawater and the top end is higher than the highest sea surface while in the flood tide; and, at least one air pipe, having a first end pipe port communicating with the interior of the upside-down lid container and the other second end pipe port being defined above the sea surface, a rotating shaft of the power generator is configured outside the second end pipe port and the second end pipe port faces the windward side or the leeward side of the blade of the rotating shaft. The said configuration enables the seawater inside the upside-down lid container to form a liquid piston, and the liquid piston will gradually rise or fall accompanying with the flood tide or ebb tide of the seawater.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

Abstract: Disclosed is a double-bead horizontal and vertical spirit level having a transparent tube contains an air bubble, a basic liquid and bead insoluble in the basic liquid and having a density greater than that of the basic liquid. By comparing the relative positions of the air bubble and bead, the spirit level gives precise measurements. An apparatus using the spirit level and protractor can measure horizontal tilt angles of upper and lower surfaces, and vertical tilt angle of the vertical plane; it can also be further combined with a laser pen to measure the angle of elevation, distance, height of a remote object, tilt angles, draw a horizontal and plumb line. An apparatus where the long axis of spirit level is perpendicular to the axis of pivot, the long axis doesn't need to pass the axis of pivot and the space could be used to install a laser pen.

Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.

Abstract: Disclosed is a double-bead horizontal and vertical spirit level having a transparent tube contains an air bubble, a basic liquid and bead insoluble in the basic liquid and having a density greater than that of the basic liquid. By comparing the relative positions of the air bubble and bead, the spirit level gives precise measurements. An apparatus using the spirit level and protractor can measure horizontal tilt angles of upper and lower surfaces, and vertical tilt angle of the vertical plane; it can also be further combined with a laser pen to measure the angle of elevation, distance, height of a remote object, tilt angles, draw a horizontal and plumb line. An apparatus where the long axis of spirit level is perpendicular to the axis of pivot, the long axis doesn't need to pass the axis of pivot and the space could be used to install a laser pen.

Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.

Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.

Abstract: A method for packaging semiconductor device is provided, which comprises: providing a carrier substrate having a top surface and a back surface, a circuit arrangement on the top surface of the carrier substrate, and a through hole is disposed near the center of the carrier substrate and is formed passed through the carrier substrate; providing a chip having an active surface and a back surface, a plurality of pads is disposed on the periphery of the active surface and a plurality of connecting elements is disposed thereon; the active surface of chip is flipped and bonded on the circuit arrangement on the top surface of the carrier substrate, and the plurality of connecting elements is not covering the through hole; filling the underfilling material to encapsulate between the plurality of connecting elements and the top surface of the carrier substrate and to fill with the through hole; and performing a suction process to remove the air within the underfilling material between the plurality of connecting eleme

Abstract: The present invention provides a semiconductor package structure, which includes a substrate having a top surface and a back surface, a plurality of first connecting points on the top surface and a plurality of second connecting points on the back surface; a chip having an active surface and back surface, a plurality of pads on the active surface, and the chip is attached on the top surface of the substrate; a plurality of wires is electrically connected the plurality of pads on the active surface of the chip with the plurality of first connecting points on the top surface of substrate; a first encapsulant is filled to cover portion of the plurality of wires, the chip, and the portion of top surface of the substrate; a second encapsulate is filled to cover the first encapsulant, the plurality of wires and is formed on portion of the top surface of the substrate, in which the Yang's module of the second encapsulant is different with that of the first encapsulant; and a plurality of connecting components is dis

Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.

Abstract: An lamp tube adapter structure is disclosed to include a lamp tube adapter, which has two lamp socket assemblies for holding a lamp tube electrically, and two connectors for connecting the lamp socket assemblies of the lamp tube adapter to the lamp holders of a conventional lamp rack electrically for allowing adjustment of the angle of the lamp tube adapter relative to the lamp holders of the lamp rack.

Abstract: A walking aid includes a support, a toilet seat, and a fixing member. The support has left and right frames, and a front frame interconnecting the left and right frames. The toilet seat is mounted pivotally on the support and has a seat plate defining a seat hole. The toilet seat is changeable between a stored position in which the seat plate is entirely supported by the front frame, and a use position in which the seat plate is supported by the left, right and front frames. The fixing member fixes the toilet seat to the support.

Abstract: An apparatus for measuring surface tension includes: a U-shaped communicating tube having a base section that defines a horizontal line, and first and second sections that extend from the base section, and that respectively have first and second top open ends distal from the base section; and a capillary connected to the second top open, and having a top open end. The U-shaped communicating tube has a diameter greater than that of the capillary such that the U-shaped communicating tube does not exhibit capillary property when a liquid is filled therein. The first top open end has a height relative to the horizontal line that is greater than that of the top open end of the capillary such that the height difference therebetween is greater than that between the liquid level at the first section and a liquid drop formed on the top open end of the capillary.

Abstract: An apparatus for measuring surface tension includes: a U-shaped communicating tube having a base section that defines a horizontal line, and first and second sections that extend from the base section, and that respectively have first and second top open ends distal from the base section; and a capillary connected to the second top open, and having a top open end. The U-shaped communicating tube has a diameter greater than that of the capillary such that the U-shaped communicating tube does not exhibit capillary property when a liquid is filled therein. The first top open end has a height relative to the horizontal line that is greater than that of the top open end of the capillary such that the height difference therebetween is greater than that between the liquid level at the first section and a liquid drop formed on the top open end of the capillary.

Abstract: A surge absorber comprises a ceramic transistor and several electrical conductors. The ceramic transistor comprises a main body and two electrode layers coated respectively on both lateral surfaces of the main body. The electrical conductors are linearly welded to the outer surface of the ceramic transistor via their respective one ends. In addition, the other ends of the electrical conductors are coupled to a terminal. Besides, the electrical conductors are linearly welded to the outer surface of the ceramic transistor so as to provide the advantages of not being easily damaged and increasing reliability.

Abstract: A modularized transformation structure for a lamp tube comprises two lamp holders, a lamp tube, two adapters, a lamp tube holder, and an electronic ballast. The adapters are attached to both ends of the lamp tube holder. Each of the adapters has an insertion trench for insertion thereinto of lamp pins on each end of the lamp tube. Each of the adapters has insertion terminals on the outer lateral for coupling with the lamp holders. The electronic ballast is mounted on the inside of the lamp tube holder for connection with the lamp pins on both ends of the lamp tube. The electronic ballast has two outputs on both ends for respective connection with one lamp holder and an inductive ballast via the other lamp holder. Accordingly, the adapters can be attached to both ends of the lamp tube easily to compensate for the insufficient length of the lamp tube.