Abstract: This application relates to the field of electronic component technologies, and to a ferrite bead, a bias circuit, an optical module, and a communication device. The ferrite bead includes: a ferrite bead body, a first fastening terminal, a second fastening terminal, and an external terminal. The first fastening terminal and the second fastening terminal are connected to the ferrite bead body, and the first fastening terminal and the second fastening terminal are configured to fasten the ferrite bead body. The ferrite bead body includes a coil structure, and the coil structure has a first electrical connection end and a second electrical connection end. At least one of the first electrical connection end and the second electrical connection end is electrically connected to the external terminal. An area of the external terminal is less than an area of the first fastening terminal and an area of the second fastening terminal.

Abstract: An apparatus for improving transmission bandwidth is provided in the embodiments of the present disclosure, which includes: a signal transmission line, side grounds located at two sides of the signal transmission line, and a capacitor disposed between the signal transmission line and the side grounds. The signal transmission line comprises a microstrip line, and the signal transmission line and the side grounds form a coplanar waveguide transmission line together. On a transmission channel connected through a bonding wire, a capacitor is disposed between a signal transmission line and side grounds. An inductor-capacitor (LC) resonance circuit is formed by using inductance characteristics presented by the bonding wire and the capacitor connected in parallel with the bonding wire, and a resonance point is formed within a frequency band in a frequency domain.

Abstract: An apparatus for improving transmission bandwidth is provided in the embodiments of the present disclosure, which includes: a signal transmission line, side grounds located at two sides of the signal transmission line, and a capacitor disposed between the signal transmission line and the side grounds. The signal transmission line comprises a microstrip line, and the signal transmission line and the side grounds form a coplanar waveguide transmission line together. On a transmission channel connected through a bonding wire, a capacitor is disposed between a signal transmission line and side grounds. An inductor-capacitor (LC) resonance circuit is formed by using inductance characteristics presented by the bonding wire and the capacitor connected in parallel with the bonding wire, and a resonance point is formed within a frequency band in a frequency domain.