Patents by Inventor Li-Hui Yang

Li-Hui Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite bump structure and methods of fabrication
    Patent number: 5393697
    Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing.
    Type: Grant
    Filed: May 6, 1994
    Date of Patent: February 28, 1995
    Assignee: Industrial Technology Research Institute
    Inventors: Shyh-Ming Chang, Yu-Chi Lee, Hsiu-Mei Yu, Li-Hui Yang, Jwo-huei Jou