Patents by Inventor Li-Jen Ko
Li-Jen Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250189950Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.Type: ApplicationFiled: February 21, 2025Publication date: June 12, 2025Inventors: KAI-TING YANG, LI-JEN KO, HSIANG YIN SHEN
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Patent number: 12259709Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.Type: GrantFiled: November 23, 2023Date of Patent: March 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kai-Ting Yang, Li-Jen Ko, Hsiang Yin Shen
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Publication number: 20240094705Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.Type: ApplicationFiled: November 23, 2023Publication date: March 21, 2024Inventors: KAI-TING YANG, LI-JEN KO, HSIANG YIN SHEN
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Patent number: 11860607Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.Type: GrantFiled: August 18, 2020Date of Patent: January 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kai-Ting Yang, Li-Jen Ko, Hsiang Yin Shen
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Publication number: 20220057775Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.Type: ApplicationFiled: August 18, 2020Publication date: February 24, 2022Inventors: KAI-TING YANG, LI-JEN KO, HSIANG YIN SHEN
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Patent number: 11062931Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.Type: GrantFiled: August 22, 2019Date of Patent: July 13, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jason Shen, Wen-Yu Huang, Li-Jen Ko, Hsiang Yin Shen
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Publication number: 20190378736Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.Type: ApplicationFiled: August 22, 2019Publication date: December 12, 2019Inventors: Jason Shen, Wen-Yu Huang, Li-Jen Ko, Hsiang Yin Shen
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Patent number: 10403532Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.Type: GrantFiled: September 20, 2012Date of Patent: September 3, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jason Shen, Wen-Yu Huang, Li-Jen Ko, Hsiang Yin Shen
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Patent number: 9852932Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: GrantFiled: November 30, 2016Date of Patent: December 26, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Mao-Lin Kao, Hsu-Shui Liu, Jiun-Rong Pai, Li-Jen Ko, Hsiang-Yin Shen, Tien-Chen Hu
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Publication number: 20170148651Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: ApplicationFiled: November 30, 2016Publication date: May 25, 2017Inventors: Mao-Lin KAO, Hsu-Shui LIU, Jiun-Rong PAI, Li-Jen KO, Hsiang-Yin SHEN, Tien-Chen HU
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Patent number: 9558974Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: GrantFiled: September 27, 2012Date of Patent: January 31, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Mao-Lin Kao, Hsu-Shui Liu, Tien-Chen Hu, Li-Jen Ko, Hsiang-Yin Shen, Jiun-Rong Pai
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Patent number: 9048274Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.Type: GrantFiled: December 8, 2008Date of Patent: June 2, 2015Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Cheng Wang, Feng-Ning Lee, Chi-Feng Tung, Mao-Lin Kao, Li-Jen Ko
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Publication number: 20140086720Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.Type: ApplicationFiled: September 27, 2012Publication date: March 27, 2014Applicant: Taiwan Semiconductor Manufaturing Company, Ltd.Inventors: Mao-Lin KAO, Hsu-Shui Liu, Tien-Chen Hu, Li-Jen Ko, Hsiang-Yin Shen, Jiun-Rong Pai
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Publication number: 20140075774Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.Type: ApplicationFiled: September 20, 2012Publication date: March 20, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jason Shen, Wen-Yu Huang, Li-Jen Ko, Hsiang Yin Shen
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Patent number: 7789576Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.Type: GrantFiled: April 25, 2007Date of Patent: September 7, 2010Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Ning Lee, Yung-Cheng Chen, Yao-Hwan Kao, Li-Jen Ko, Chin-Hsiang Lin
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Publication number: 20100143082Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.Type: ApplicationFiled: December 8, 2008Publication date: June 10, 2010Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Cheng Wang, Feng-Ning Lee, Chi-Feng Tung, Mao-Lin Kao, Li-Jen Ko
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Publication number: 20080241760Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.Type: ApplicationFiled: April 25, 2007Publication date: October 2, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng-Ning Lee, Yung-Cheng Chen, Yao-Hwan Kao, Li-Jen Ko, Chin-Hsiang Lin