Patents by Inventor Lijian Ding

Lijian Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11851692
    Abstract: Disclosed are an antimycin compound and a preparation method and use thereof. The preparation method comprises: fermenting a marine actinomycete (Streptomyces sp.4-7) with a preservation number CCTCCNO: M2020953 to obtain a fermented product and soaking and extracting the fermented product with ethyl acetate to obtain a crude extract; and carrying out separation and purification by normal-phase silica gel column chromatography, reversed-phase MPLC, and semi-preparative reversed-phase high-performance liquid chromatography. The invention has the advantages of resistance against Botrytis cinerea and Penicillium citrinum.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: December 26, 2023
    Assignee: NINGBO UNIVERSITY
    Inventors: Lijian Ding, Shan He, Wenhao Li, Weiyan Zhang, Yingying Wei
  • Publication number: 20230313247
    Abstract: An antimycin compound and a preparation method and use thereof are provided. The preparation method comprises: fermenting a marine actinomycete (Steptomyces sp.4-7) with a preservation number CCTCCNO: M2020953 to obtain a fermented product and soaking and extracting the fermented product with ethyl acetate to obtain a crude extract; and carrying out separation and purification by normal-phase silica gel column chromatography, reversed-phase MPLC, and semi-preparative reversed-phase high-performance liquid chromatography. The antimycin compound has the advantages of resistance against Botrytis cinerea and Penicillium citrinum.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 5, 2023
    Applicant: Ningbo University
    Inventors: Lijian DING, Shan HE, Wenhao LI, Weiyan ZHANG, Yingying WEI
  • Patent number: 8745851
    Abstract: A process for fabricating an ultra-low-resistance superconducting joint that has high shielding characteristics. The process includes: corroding copper on the outer surface at the end of a NbTi/Cu superconducting wire to form terminal NbTi superconducting filaments; inserting same number of NbTi superconducting filaments into each through hole of the niobium layer of a Nb/NbTi/Cu multilayer composite rod; pressing at the outside of the Nb/NbTi/Cu multilayer composite rod to combine the Nb/NbTi/Cu multilayer composite rod and NbTi superconducting filaments together to form a joint; and inserting the joint into a YBCO tube, and then filling the YBCO tube with molten bismuth-lead-tin-cadmium (BiPbSnCd) alloy solder to form a superconducting joint with high shielding and low resistance characteristics.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 10, 2014
    Assignee: Institute of Electrical Engineering, Chinese Academy of Sciences
    Inventors: Qiuliang Wang, Xinning Hu, Shousen Song, Lijian Ding, Luguang Yan
  • Publication number: 20130008018
    Abstract: A low resistance superconducting joint with high shielding characteristics, manufactured by: corroding copper on the outer surface at the end of a NbTi/Cu superconducting wire to form terminal NbTi superconducting filaments; inserting same number of NbTi superconducting filaments into each through hole of the niobium layer of a Nb/NbTi/Cu multilayer composite rod; pressing at the outside of the Nb/NbTi/Cu multilayer composite rod to combine the Nb/NbTi/Cu multilayer composite rod and NbTi superconducting filaments together to form a joint; and inserting the joint into a YBCO tube, and then filling the YBCO tube with molten bismuth-lead-tin-cadmium (BiPbSnCd) alloy solder to form a superconducting joint with high shielding and low resistance characteristics.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 10, 2013
    Applicant: Institute of Electrical Engineering, Chinese Academy of Sciences
    Inventors: Qiuliang Wang, Xinning Hu, Shousen Song, Lijian Ding, Luguang Yan