Abstract: Features are detected from a sensor signal via a deep-learning network or other feature engineering methods in an edge processing node. Machine-learned metadata is created that describes the features, and a hash is created with the machine-learned metadata. The sensor signal is stored as a content object at the edge processing node, the object being keyed with the hash at, the edge processing node.

Abstract: Features are detected from a sensor signal via a deep-learning network or other feature engineering methods in an edge processing node. Machine-learned metadata is created that describes the features, and a hash is created with the machine-learned metadata. The sensor signal is stored as a content object at the edge processing node, the object being keyed with the hash at, the edge processing node.

Abstract: A tray system for containing multiple electronic components that includes a first tray having a planar member and a plurality of pockets recessed into an upper surface of the planar member, wherein each of the pockets includes: a bottom surface; an aperture extending through the bottom surface; a supply channel extending from a lower surface of the planar member to the aperture; a plurality of wall segments extending from the bottom surface of the pocket to the upper surface of the planar member and defining a perimeter of the pocket; and a plurality of pedestals extending from the bottom surface of the pocket toward the upper surface of the first tray.

Abstract: A tray system for containing multiple electronic components that includes a first tray having a planar member and a plurality of pockets recessed into an upper surface of the planar member, wherein each of the pockets includes: a bottom surface; an aperture extending through the bottom surface; a supply channel extending from a lower surface of the planar member to the aperture; a plurality of wall segments extending from the bottom surface of the pocket to the upper surface of the planar member and defining a perimeter of the pocket; and a plurality of pedestals extending from the bottom surface of the pocket toward the upper surface of the first tray.

Abstract: Two microelectronic components can be attached by flowing solder between solderable pads patterned on interfacing surfaces. According to one implementation, the microelectronic components can include the solderable pads patterned onto first respective surfaces and other surface features patterned onto second respective surfaces. In another implementation, the solderable pads can include an adhesion layer, a diffusion barrier layer, and a surface oxidation layer.

Abstract: In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.

Abstract: An apparatus includes a slider with a cavity in a trailing end of the slider. A laser is positioned in the cavity and has an output facet positioned adjacent to a first wall of the cavity. A cap is connected to the trailing end of the slider and covers the laser.

Abstract: An apparatus includes a slider with a cavity in a trailing end of the slider. A laser is positioned in the cavity and has an output facet positioned adjacent to a first wall of the cavity. A cap is connected to the trailing end of the slider and covers the laser.

Abstract: A multiple layered interconnect structure to provide an electrical interface between one or more electrical elements on a head to read/write circuitry is disclosed. The interconnect structure includes first and second interconnecting layers. The first interconnecting layer is formed on a slider body of the head and includes a first or lower bond pad connectable to one or more electrical elements on the slider body through the first interconnecting layer. The second interconnecting layer includes a second or upper bond pad connectable to the one or more transducer elements through the second interconnecting layer. The second interconnecting layer is on top of the first interconnecting layer and the structure includes an insulating layer between the first and second interconnecting layers.

Abstract: In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.

Abstract: A slider for a disc drive assembly may be attached to various substrates during manufacture and installation in the disc drive assembly. In some examples, a slider attachment system includes a substrate, a first diffusion barrier layer formed over the substrate, a first solder-wettable protection layer formed over the first diffusion barrier layer, a second diffusion barrier layer formed over the first solder-wettable protection layer, and a second solder-wettable protection layer formed over the second diffusion barrier layer. The first and second solder-wettable protection layers may be formed of a material that is inert to a chemical etchant that can chemically dissolve the diffusion barrier layers. In use, solder may be applied to the second solder-wettable protection layer to wet and dissolve the layer. If the substrate needs to be detached and reattached, etchant can chemically dissolve the second diffusion barrier layer to expose the first solder-wettable layer for reattachment.

Abstract: Two microelectronic components can be attached by flowing solder between solderable pads patterned on interfacing surfaces. According to one implementation, the microelectronic components can include the solderable pads patterned onto first respective surfaces and other surface features patterned onto second respective surfaces. In another implementation, the solderable pads can include an adhesion layer, a diffusion barrier layer, and surface oxidation layer.

Abstract: In accordance with one embodiment, a method is disclosed that comprises disposing an antireflection material in juxtaposition with a top surface of a slider. In accordance with another embodiment, a method is disclosed that comprises disposing an antireflective material between a facet edge of a laser and an incident surface of a waveguide. In yet another embodiment, an apparatus is disclosed that comprises a slider and an antireflection material in juxtaposition with a top surface of the slider.

Abstract: A method includes: positioning a laser in the cavity in an end of a slider, wherein the laser has an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and filling at least a portion of the first gap adjacent to the output facet. An apparatus including a slider including a cavity in a trailing end of the slider, a laser positioned in the cavity and having an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and a sealing material filling at least a portion of the first gap adjacent to the output facet is also provided.

Abstract: A method includes: positioning a laser in the cavity in an end of a slider, wherein the laser has an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and filling at least a portion of the first gap adjacent to the output facet. An apparatus including a slider including a cavity in a trailing end of the slider, a laser positioned in the cavity and having an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and a sealing material filling at least a portion of the first gap adjacent to the output facet is also provided.