Patents by Inventor Lijun Yi

Lijun Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB board assembling method and assembling system
    Patent number: 10614386
    Abstract: A printed circuit board (PCB) panelization method and a PCB panelization system are disclosed herein. The PCB panelization method comprises the following steps: S1, reading daughterboard information of purchase orders, wherein the daughterboard information comprises respective areas, delivery quantities and attributes of daughterboards; S2, performing comparison of the daughterboard information, screening for daughterboards having attributes that are the same, and establishing a panelization rule database; S3, selecting panels (PNLs) satisfying requirements according to panelization requirements; S4, selecting, from the daughterboards having the same attributes as the selected panels, daughterboards to be panelized together for the selected panels, and arranging a graphical layout for a panelization of the selected panels.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: April 7, 2020
    Assignees: Guangzhou Fastprint Circuit Tech Co., Ltd., Shenzhen Fastprint Circuit Tech Co., Ltd.
    Inventors: Xianwen Lu, Dejin Zhang, Lijun Yi, Xi Chen
  • PCB BOARD ASSEMBLING METHOD AND ASSEMBLING SYSTEM
    Publication number: 20190019115
    Abstract: A printed circuit board (PCB) panelization method and system. The method comprises the following steps: S1, reading daughterboard information of purchase orders, wherein the daughterboard information comprises the respective areas, delivery quantities and attributes of daughterboards; S2, performing comparison of the daughterboard information, screening for daughterboards having the same attributes, and establishing a panelization rule database; S3, selecting panels (PNL) satisfying the requirements according to panelization requirements; S4, selecting, from the daughterboards having the same attributes as the selected panels, daughterboards to be panelized together for the selected panels, and arranging the layout for the panelization.
    Type: Application
    Filed: August 26, 2016
    Publication date: January 17, 2019
    Applicants: GUANGZHOU FASTPRINT CIRCUIT TECH CO., LTD., SHENZHEN FASTPRINT CIRCUIT TECH CO., LTD., GUANGZHOU FASTPRINT ELECTRONIC CO., LTD.
    Inventors: Xianwen Lu, Dejin Zhang, Lijun Yi, Xi Chen