Patents by Inventor Liken Lin

Liken Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6341641
    Abstract: A mold with additional thermo chamber for homogenous temperature distribution comprises a first mold half having a first mold cavity and a plurality of first distributing channels directing to the first mold cavity. The first mold half further includes a sprout in communicating with the first distributing channels. A second mold half has a second mold cavity corresponding to the first mold cavity. The second mold half further includes a recess for receiving the sprout of the first mold half. The second mold further includes an inlet in communicating with the sprout for receiving molten metal. A third mold half is assembled to the first mold half. A thermo chamber is defined between the third mold half and the first mold half for receiving molten metal therein thereby increasing mold temperature of the first mold.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: January 29, 2002
    Inventor: Liken Lin
  • Patent number: 6333852
    Abstract: The CPU heat dissipation device with special fins includes a fan sink mounted above a CPU with a plurality of fins, a fan and a cover thereof. A slot is mounted on the fan sink while a socket for mounting a fan is disposed on one side thereof. The cover is covered on the top of the fan sink. The characteristic of the device is in special fins which have different designs such as elliptic shaped, strip-shaped, foliar shape, and crescent shape. In accordance with the structure mentioned above, the velocity of airflow is increased by the high-pressure channels composed of various kinds of fins. Thus the heat dispersion rate can be improved.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: December 25, 2001
    Inventor: Liken Lin
  • Patent number: 6331125
    Abstract: An improved structure of connector for peripheral devices comprises a housing and a plurality of terminals while a number of passages are disposed longitudinally at the rear side of the housing for insertion of the terminals respectively. The features of the present invention include: The side-view of the front part of the terminal is V-shaped and the enlarged body portion of terminal is mounted into the passages and the leg of terminal extending rearwardly from the rear side of the body portion is welded to the rear side of the housing. With the foregoing structure, the anti-bent ability of terminal is increased due to the enlarged body portion mounted into the passages and only the leg exposed outside the housing. In addition, the distance between adjacent terminal legs is apparent longer than the distance between adjacent terminals of the prior art thus the short caused by electrical arc effect originating from the short distance between two terminals under the high-voltage situation can be prevented.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: December 18, 2001
    Inventor: Liken Lin
  • Patent number: 6321452
    Abstract: A method of manufacturing a heat pipe integrated into a heat sink. A pipe-shaped groove is mounted into the mold of the heat sink. The heat pipe is shaped into a form fitting into the groove and mounted into the groove. The heat sink is formed by compression casting and the heat pipe is integrated into the heat sink. The heat pipe has at least one open end exposed to the lateral side of the heat sink. Heat conductive liquid is filled into the heat pipe through the above open end which is sealed by tin afterwards. According to the foregoing method, the heat pipe is formed integrally in the heat sink so that the separation of the heat pipe can be avoided and the efficiency of heat dissipation is also improved.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: November 27, 2001
    Inventor: Liken Lin
  • Patent number: 6304440
    Abstract: A shock-proof device of an external hard disk driver box suitable for personal computer or notebook computer is disclosed. The shock-proof device has a high capacity memory which is replaceable as pleasure. The damage of hard disk within the shock-proof device of the present invention due to shock and vibration can be prevented and the hard disk will not be destroyed. A shock-proof device of an external hard disk driver box comprises an upper cover, a hard disk and a seat. The hard disk is placed in the seat and is connected to the connecting ports and power receptacle at the rear edge of the seat by a signal bank wire and a power wire for being used externally. The periphery of the hard disk is installed with fixing block and the upper and lower surfaces of the hard disk and fixing block are disposed with a plurality of soft protecting pads.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: October 16, 2001
    Inventor: Liken Lin
  • Patent number: 6283592
    Abstract: A nose pad assembling for eyeglass frame includes a pair of nose pads mounted on the inner side of eyeglass frame respectively. The feature of the device is in that a pair of inserting tube integrated into the inner side of eyeglass frame. An inserting post with a piece of thermoplastic membrane on one end is arranged on the rear side of the nose pad. By inserting the inserting post into the receiving tube and heating the thermoplastic membrane from the bottom of the receiving tube, the inserting post is fixed firmly with the receiving tube for connecting the nose pad with the eyeglass frame.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: September 4, 2001
    Inventor: Liken Lin
  • Patent number: 5978219
    Abstract: A heat dissipating device for CPU generally comprises a bracket, a cooling fan, a specially designed air hose that connects the inlet of the cooling fan and the inlet of the computer housing, and an upper lid. The specially designed air hose is connected to the inlet of the cooling fan. The other end of the hose is arranged such that it may draw the fresh air into the computer housing. The bracket is preferably made from aluminum and can be properly mounted onto the top surface of the CPU. When the cooling fan operates, the cooling air can be readily sucked and directed to the mounting recess of the bracket. The heat built-up resulted from the operation of CPU can be readily dissipated by those introduced airflow. When the airflow passes through the heat dissipating fins, the heat from the CPU can be effectively dissipated.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: November 2, 1999
    Inventor: Liken Lin