Patents by Inventor Lili Borna

Lili Borna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insert molded or over molded insulating layers on enclosures for microphone assemblies
    Patent number: 11696082
    Abstract: A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.
    Type: Grant
    Filed: July 25, 2020
    Date of Patent: July 4, 2023
    Assignee: Knowles Electronics, LLC
    Inventors: Norman Dennis Talag, Lili Borna, Tony K. Lim
  • INSERT MOLDED OR OVER MOLDED INSULATING LAYERS ON ENCLOSURES FOR MICROPHONE ASSEMBLIES
    Publication number: 20210037330
    Abstract: A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.
    Type: Application
    Filed: July 25, 2020
    Publication date: February 4, 2021
    Inventors: Norman Dennis Talag, Lili Borna, Tony K. Lim