Abstract: The present invention belongs to the medical field, and relates to novel ?-lactamase inhibitors, for the treatment of bacterial infections in combination with ?-lactam antibiotics, including infection caused by drug resistant organisms and especially multi-drug resistant organisms. The present invention includes compounds according to formula (I): or pharmaceutically acceptable salts thereof, wherein M and R are as defined herein.

Abstract: A display screen cover is arranged to correspond to an area array driving plate of a display screen, and the display screen cover includes a cover body and a polarization film assembly. The polarization film assembly is arranged on the back of the cover body, and the polarization film assembly is provided with polarization film through holes and polarization film sound transmission spaces. The polarization film through holes are arranged to correspond to light-emitting tubes of the area array driving plate, and the polarization film sound transmission spaces are arranged to correspond to sound transmission spaces of the area array driving plate. The cover body is provided with cover through holes and cover sound transmission spaces. The cover through holes are arranged to correspond to the polarization film through holes, and the cover sound transmission spaces are arranged to correspond to the polarization film sound transmission spaces.

Abstract: A system to assess the current, or future workload of a pilot and automatically providing annunciation when needed to the pilot, as well as to resources that support the pilot. The system may automatically, and without pilot involvement, assess the workload for the pilot based on incoming events and abnormal scenarios. The predicted incoming events may be related to operation data, such as navigation information, weather, traffic avoidance, and so on. The system may also detect abnormal scenarios, such as engine warnings, fuel or other aircraft issues. The system may determine whether the predicted incoming events or the abnormal scenario satisfies one or more pre-defined criteria. Based on the event satisfying one or more criteria, the system may output an annunciation to either the pilot, resources that support the pilot, such as an additional pilot and air traffic control (ATC).

Abstract: A switched-mode light-emitting diode (LED) display unit satisfying fire-fighting smoke exhaust and ventilation requirements includes an LED display unit, a mounting member, an opening-closing actuator and a pressing member. The LED display unit is mounted on the mounting member and the mounting member is mounted on a display panel by an opening-closing actuator and pressed against the display panel by a pressing member. The switched-mode LED display unit provides the pressing member that works to release the pressed mounting member after obtaining a triggering command and the opening-closing actuator that turns on the LED display unit subsequently, thereby meeting the fire smoke exhaust ventilation requirement of the internal surface or the external surface of a building.

Abstract: A curved display screen forming method includes: modeling to obtain a virtual display layer, and segmenting the display layer to obtain a size of a virtual display module; mapping the size of the virtual display module to obtain a size of a materialized display module; reducing edges of the materialized display module, and arranging an adjustment protrusion on each edge of the materialized display module; modeling to obtain a virtual adjustment layer, wherein a virtual plate of the virtual adjustment layer corresponds to the plurality of virtual display modules, obtaining a size of the virtual plate; converting the size of the virtual plate from a curved surface to a plane to obtain a planar size of the materialized plate; and assembling the materialized display module and the materialized plate to form a curved display screen.

Abstract: A curved display screen forming method includes: modeling to obtain a virtual display layer, and segmenting the display layer to obtain a size of a virtual display module; mapping the size of the virtual display module to obtain a size of a materialized display module; reducing edges of the materialized display module, and arranging an adjustment protrusion on each edge of the materialized display module; modeling to obtain a virtual adjustment layer, wherein a virtual plate of the virtual adjustment layer corresponds to the plurality of virtual display modules, obtaining a size of the virtual plate; converting the size of the virtual plate from a curved surface to a plane to obtain a planar size of the materialized plate; and assembling the materialized display module and the materialized plate to form a curved display screen.

Abstract: An arc-shaped display screen with double-curved surface includes an arc-shaped frame and a plurality of LED display unit boards. The plurality of LED display unit boards are mounted on an inner surface or an outer surface of the arc-shaped frame in a detachable manner, and surfaces of the plurality of LED display unit boards constitute the arc-shaped display screen with double-curved surface. The frame is formed by splicing a plurality of structural units, and adjacent structural units are fixedly connected to each other. Each of the LED display unit boards is electrically connected to an external circuit. The arc-shaped display screen with double-curved surface has a simple structure and low cost. Moreover, compared with the movie screens of the existing screens with single curved surface, the arc-shaped display screen with double-curved surface has wider viewing angle, ultra-high picture definition, and high-fidelity sound quality etc.

Abstract: An arc-shaped display screen with double-curved surface includes an arc-shaped frame and a plurality of LED display unit boards. The plurality of LED display unit boards are mounted on an inner surface or an outer surface of the arc-shaped frame in a detachable manner, and surfaces of the plurality of LED display unit boards constitute the arc-shaped display screen with double-curved surface. The frame is formed by splicing a plurality of structural units, and adjacent structural units are fixedly connected to each other. Each of the LED display unit boards is electrically connected to an external circuit. The arc-shaped display screen with double-curved surface has a simple structure and low cost. Moreover, compared with the movie screens of the existing screens with single curved surface, the arc-shaped display screen with double-curved surface has wider viewing angle, ultra-high picture definition, and high-fidelity sound quality etc.

Abstract: Systems and methods may be used to produce coated components. Exemplary chamber components may include an aluminum, stainless steel, or nickel plate defining a plurality of apertures. The plate may include a hybrid coating, and the hybrid coating may include a first layer comprising a corrosion resistant coating. The first layer may extend conformally through each aperture of the plurality of apertures. The hybrid coating may also include a second layer comprising an erosion resistant coating extending across a plasma-facing surface of the semiconductor chamber component.

Abstract: The present disclosure provides methods for cleaning chamber components post substrate etching. In one example, a method for cleaning includes activating an etching gas mixture using a plasma to create an activated etching gas mixture, the etching gas mixture comprising hydrogen-containing precursor and a fluorine-containing precursor and delivering the activated etching gas mixture to a processing region of a process chamber, the process chamber having an edge ring positioned therein, the edge ring comprising a catalyst and anticatalytic material, wherein the activated gas removes the anticatalytic material from the edge ring.

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.

Abstract: The present disclosure provides methods for cleaning chamber components post substrate etching. In one example, a method for cleaning includes activating an etching gas mixture using a plasma to create an activated etching gas mixture, the etching gas mixture comprising hydrogen-containing precursor and a fluorine-containing precursor and delivering the activated etching gas mixture to a processing region of a process chamber, the process chamber having an edge ring positioned therein, the edge ring comprising a catalyst and anticatalytic material, wherein the activated gas removes the anticatalytic material from the edge ring.

Abstract: Systems and methods for fabricating a microelectric device are provided herein. Particular embodiments provide systems and methods for fabricating a magnetic recording pole for a magnetic recording head, such as an energy assisted magnetic recording (EAMR) head commonly used in a disk storage device. Some embodiments provide for systems and methods of fabricating magnetic recording poles that protect the core of the magnetic recording head during the removal of removal of seed layers.

Abstract: Methods of treating the interior of a plasma region are described. The methods include a preventative maintenance procedure or the start-up of a new substrate processing chamber having a remote plasma system. A new interior surface is exposed within the remote plasma system. The (new) interior surfaces are then treated by sequential steps of (1) forming a remote plasma from hydrogen-containing precursor within the remote plasma system and then (2) exposing the interior surfaces to water vapor. Steps (1)-(2) are repeated at least ten times to complete the burn-in process. Following the treatment of the interior surfaces, a substrate may be transferred into a substrate processing chamber. A dielectric film may then be formed on the substrate by flowing one precursor through the remote plasma source and combining the plasma effluents with a second precursor flowing directly to the substrate processing region.

Abstract: Methods of treating the interior of a plasma region are described. The methods include a preventative maintenance procedure or the start-up of a new substrate processing chamber having a remote plasma system. A new interior surface is exposed within the remote plasma system. The (new) interior surfaces are then treated by sequential steps of (1) forming a remote plasma from hydrogen-containing precursor within the remote plasma system and then (2) exposing the interior surfaces to water vapor. Steps (1)-(2) are repeated at least ten times to complete the burn-in process. Following the treatment of the interior surfaces, a substrate may be transferred into a substrate processing chamber. A dielectric film may then be formed on the substrate by flowing one precursor through the remote plasma source and combining the plasma effluents with a second precursor flowing directly to the substrate processing region.

Abstract: Methods of forming dielectric layers are described. The methods may include forming a silicon-nitrogen-and-hydrogen-containing layer on a substrate. The methods include ozone curing the silicon-nitrogen-and-hydrogen-containing layer to turn the silicon-nitrogen-and-hydrogen-containing layer into a silicon-and-oxygen-containing layer. Following ozone curing, the layer is exposed to an amine-water combination at low temperature before an anneal. The presence of the amine cure allows the conversion to silicon-and-oxygen-containing layer to occur more rapidly and completely at a lower temperature during the anneal. The amine cure also enables the anneal to use a less oxidative environment to effect the conversion to the silicon-and-oxygen-containing layer.

Abstract: Techniques for controllably directing beamlets to a target substrate are disclosed. The beamlets may be either positive ions or electrons. It has been shown that beamlets may be produced with a diameter of 1 ?m, with inter-aperture spacings of 12 ?m. An array of such beamlets, may be used for maskless lithography. By step-wise movement of the beamlets relative to the target substrate, individual devices may be directly e-beam written. Ion beams may be directly written as well. Due to the high brightness of the beamlets from extraction from a multicusp source, exposure times for lithographic exposure are thought to be minimized. Alternatively, the beamlets may be electrons striking a high Z material for X-ray production, thereafter collimated to provide patterned X-ray exposures such as those used in CAT scans. Such a device may be used for remote detection of explosives.

Abstract: Techniques for controllably directing beamlets to a target substrate are disclosed. The beamlets may be either positive ions or electrons. It has been shown that beamlets may be produced with a diameter of 1 ?m, with inter-aperture spacings of 12 ?m. An array of such beamlets, may be used for maskless lithography. By step-wise movement of the beamlets relative to the target substrate, individual devices may be directly e-beam written. Ion beams may be directly written as well. Due to the high brightness of the beamlets from extraction from a multicusp source, exposure times for lithographic exposure are thought to be minimized. Alternatively, the beamlets may be electrons striking a high Z material for X-ray production, thereafter collimated to provide patterned X-ray exposures such as those used in CAT scans. Such a device may be used for remote detection of explosives.