Patents by Inventor Lili Wei

Lili Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170330999
    Abstract: A method of separating a wafer including rows of light emitting devices is described. Dicing streets are provided on the wafer such that a respective one of the dicing streets is provided between each of the rows of light emitting devices on the wafer. The wafer is broken along a first one of the dicing streets to separate a first portion of the wafer from a remaining portion of the wafer. The first portion of the wafer includes more than one of the rows of light emitting devices. The first portion of the wafer is broken along a second one of the dicing streets to separate a second portion of the wafer from the first portion of the wafer.
    Type: Application
    Filed: July 31, 2017
    Publication date: November 16, 2017
    Applicant: Lumileds LLC
    Inventors: Rao S. Peddada, Frank Lili Wei
  • Patent number: 9773941
    Abstract: Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The light emitting devices are disposed in rows. The method includes dividing the wafer into a plurality of regions. Each region comprises a plurality of rows of light emitting devices and a first region is wider than a second region. For each region, the method includes determining a position of first and second dicing streets. The dicing streets are located between the rows of light emitting devices. The method includes determining, using the position of the first and second dicing streets, positions of a plurality of dicing streets disposed between the first and second dicing streets. The method includes cutting the wafer along streets.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: September 26, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Satyanarayana Rao Peddada, Frank Lili Wei
  • Patent number: 9722138
    Abstract: Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The method includes scribing a first groove on a dicing street on the wafer and checking the alignment of the wafer using a location of the first groove relative to a feature on the wafer. After checking the alignment, a second groove is scribed on the dicing street.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: August 1, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Rao S. Peddada, Frank Lili Wei
  • Patent number: 9521084
    Abstract: Embodiments of the present invention relate to the field of communications, and provide a network coding method, a relay apparatus and a selection apparatus, which can avoid a case that a network coding system matrix is not full rank, and improve correctness of decoding. The network coding method includes: obtaining network coding information, where the network coding information includes information of a candidate network coding vector set and a candidate transmission rate set, and transmission rates in the candidate transmission rate set are in one-to-one correspondence with network coding vectors in the candidate network coding vector set; selecting a full rank network matrix according to the network coding information; and coding received source node information according to the full rank network matrix. The network coding method, relay apparatus and selection apparatus provided in the embodiments of the present invention are used for network coding.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: December 13, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lili Wei, Wen Chen, Yuejun Wei, Ying Jin
  • Publication number: 20160268473
    Abstract: Embodiments of the invention include a method for separating a wafer including a growth substrate and a plurality of devices formed on the growth substrate and arranged in a plurality of rows separated by at least one street. The wafer includes a front side on which the plurality of devices are formed and a back side, which is a surface of the growth substrate. The method includes scribing a first scribe line aligned with the street on the front side, scribing a second scribe line aligned with the street on the back side, and scribing a third scribe line aligned with the street on the back side.
    Type: Application
    Filed: October 13, 2014
    Publication date: September 15, 2016
    Inventors: S. Rao Peddada, Frank Lili Wei, Enrico Casaje, Rajat Sharma
  • Publication number: 20160268472
    Abstract: Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The light emitting devices are disposed in rows. The method includes dividing the wafer into a plurality of regions. Each region comprises a plurality of rows of light emitting devices and a first region is wider than a second region. For each region, the method includes determining a position of first and second dicing streets. The dicing streets are located between the rows of light emitting devices. The method includes determining, using the position of the first and second dicing streets, positions of a plurality of dicing streets disposed between the first and second dicing streets. The method includes cutting the wafer along streets.
    Type: Application
    Filed: October 22, 2014
    Publication date: September 15, 2016
    Inventors: Satyanarayana Rao Peddada, Frank Lili Wei
  • Publication number: 20160260865
    Abstract: Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The method includes scribing a first groove on a dicing street on the wafer and checking the alignment of the wafer using a location of the first groove relative to a feature on the wafer. After checking the alignment, a second groove is scribed on the dicing street.
    Type: Application
    Filed: October 21, 2014
    Publication date: September 8, 2016
    Inventors: Rao S. Peddada, Frank Lili Wei
  • Publication number: 20150008459
    Abstract: A two-stage singulation process is used in the fabrication of phosphor coated light emitting elements. Prior to the application of the phosphor coating, the individual light emitting elements are singulated using a laser dicing process (130); after application of the phosphor coating (150), the phosphor coated light emitting elements are singulated using a mechanical dicing process (180). Before laser dicing of the light emitting elements, the wafer is positioned on a piece of dicing- or die-attach-tape held by a frame; after laser dicing, the tape is stretched (140) to provide space between the individual light emitting elements that allows for the wider kerf width of the subsequent mechanical dicing (180) after application of the phosphor coating (150).
    Type: Application
    Filed: March 8, 2013
    Publication date: January 8, 2015
    Inventor: Frank Lili Wei
  • Publication number: 20140341022
    Abstract: Embodiments of the present invention relate to the field of communications, and provide a network coding method, a relay apparatus and a selection apparatus, which can avoid a case that a network coding system matrix is not full rank, and improve correctness of decoding. The network coding method includes: obtaining network coding information, where the network coding information includes information of a candidate network coding vector set and a candidate transmission rate set, and transmission rates in the candidate transmission rate set are in one-to-one correspondence with network coding vectors in the candidate network coding vector set; selecting a full rank network matrix according to the network coding information; and coding received source node information according to the full rank network matrix. The network coding method, relay apparatus and selection apparatus provided in the embodiments of the present invention are used for network coding.
    Type: Application
    Filed: August 5, 2014
    Publication date: November 20, 2014
    Inventors: Lili Wei, Wen Chen, Yuejun Wei, Ying Jin