Patents by Inventor Liliana V. DE LILLO

Liliana V. DE LILLO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11855495
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: December 26, 2023
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Patent number: 11824406
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: November 21, 2023
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Patent number: 11777380
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: October 3, 2023
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Patent number: 11777379
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: October 3, 2023
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Patent number: 11489418
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: November 1, 2022
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Publication number: 20220021283
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Application
    Filed: August 11, 2021
    Publication date: January 20, 2022
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J.F. Tighe
  • Publication number: 20220021284
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Application
    Filed: August 11, 2021
    Publication date: January 20, 2022
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J.F. Tighe
  • Publication number: 20220014077
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Application
    Filed: August 11, 2021
    Publication date: January 13, 2022
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J.F. Tighe
  • Publication number: 20210376695
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J.F. Tighe
  • Patent number: 10855146
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 1, 2020
    Assignee: ITT Manufacturing Enterprises LLC
    Inventors: Dean P. Williams, Mark A. Playford, Daniel J. Kernan, Lee Empringham, Liliana V. De Lillo, Christopher J. F. Tighe
  • Publication number: 20180294738
    Abstract: This invention relates to the field of matrix converters and more specifically to the field of matrix converters comprising bidirectional switches. There is proposed a concept of providing a minimum transistor switching period for any given transistor in the matrix converter. Such a minimum transistor switching period may be induced by introducing a delay into a commutation sequence that is typically used to switch an output from a first input to a second input.
    Type: Application
    Filed: May 13, 2016
    Publication date: October 11, 2018
    Inventors: Dean P. WILLIAMS, Lee EMPRINGHAM, Liliana V. DE LILLO
  • Publication number: 20170264171
    Abstract: A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 14, 2017
    Inventors: Dean P. WILLIAMS, Mark A. PLAYFORD, Daniel J. KERNAN, Lee EMPRINGHAM, Liliana V. DE LILLO, Christopher J.F. TIGHE