Abstract: A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate. The chip structure has an inclined sidewall, the inclined sidewall is at an acute angle to a vertical, the vertical is a direction perpendicular to a main surface of the chip structure, and the acute angle is in a range from about 12 degrees to about 45 degrees. The method also includes forming a protective layer to surround the chip structure.

Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: An optical recording medium dye is described. The optical recording medium dye is an azo metal chelate compound, wherein the azo metal chelate compound comprises the following structure: wherein R1 is a hydrogen atom, a C1-6 straight chain or branched alkyl group, an amino group, an alkylamino group or a tolylamino group; R2 is a hydrogen atom, a hydroxyl group, a halogen atom, an ether group, a C1-6 straight chain or branched alkyl group; R3 is a hydrogen atom, a C1-6 straight chain or branched alkyl group; R4 is a hydrogen atom, a C1-6 straight chain or branched alkyl group or a halogen atom; A3 is a residue forming a heterocyclic ring derivative together with a carbon atom and a nitrogen atom.

Abstract: An optical recording medium dye is described.

Abstract: A process for preparing alkoxy- and aryloxy-phenols involves the steps of reacting a benzaldehyde derivative with a peracid to form a benzodioxole derivative, removing non-reacted peracid from the reaction mixture, and reacting the benzodioxole derivative in the reaction mixture with a hydrolyzing agent.