Patents by Inventor Lilith Montayre

Lilith Montayre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Robust leaded molded packages and methods for forming the same
    Publication number: 20060231933
    Abstract: A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.
    Type: Application
    Filed: June 1, 2006
    Publication date: October 19, 2006
    Inventors: Elsie Cabahug, Marvin Gestole, Margie Tumulak-Rios, Lilith Montayre, Romel Manatad