Patents by Inventor Lillian Charell Thompson

Lillian Charell Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9831201
    Abstract: The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: November 28, 2017
    Inventors: Guy F. Burgess, Theodore Gerard Tessier, Anthony Paul Curtis, Lillian Charell Thompson
  • Publication number: 20160268223
    Abstract: The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.
    Type: Application
    Filed: March 11, 2015
    Publication date: September 15, 2016
    Applicant: Flipchip International LLC
    Inventors: Guy F. Burgess, Theodore Gerard Tessier, Anthony Paul Curtis, Lillian Charell Thompson