Abstract: An aqueous degreasing composition which is free of silicates, chelates and inorganic phosphates and a method for degreasing metal substrates which are sensitive to these types of compositions. The composition of the present invention includes: an alkali builder constituent which contains no phosphates, silicates or chelates; and a nonionic surfactant effective amounts for removing oils from a substrate, a hydrotrope constituent in effective amounts for solubilizing the soils removed and for solubilizing the nonionic surfactant and an amphoteric surfactant in effective amounts for removing long chain soils from substrates and a salt of polymerized alkyl naphthalene sulfonic acid as a dispersant with the remainder being water. In the method of the present invention, the above composition is diluted from about 1% to about 100% by volume with water to provide a desoiling solution. The solution is then heated to a temperature from about 100.degree. F. to about 200.degree. F.

Abstract: A low solids, solvent free liquid aqueous degreasing concentrate composition having high free alkalinity which includes from about 20% to about 40% by weight of an alkali builder constituent; from about 15% to about 25% by weight of a wetting agent mixture comprising; from about 60% to about 85% of an anionic or amphoteric wetting agent selected from the group consisting of anionic surfactants and amphoteric and anionic hydrotropes and from about 15% to about 40% non-ionic wetting agents; and the remainder water.

Abstract: A cyanide-free electrolyte and process for depositing a ductile, fine-grained, adherent copper plate usually of a thickness of about 0.015 to about 5 mils on ferrous-base, copper-base, zinc-base and the like conductive substrates. The electrolyte contains controlled effective amounts of cupric ions complexed with an organo-phosphonate chelating agent, an alkali carbonate as a bath stabilizing and buffering agent, hydroxyl ions to provide a pH on the alkaline side and preferably, a wetting agent. The copper plate is applied by electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble ferrite anode to provide a copper to ferrite anode surface area ratio within a range of about 1:2 to about 1:6.

Abstract: A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.

Abstract: An improved electrolytic bath composition and process for stripping relatively thick copper, copper alloy, or chromium deposits from a ferrous basis metal comprising an aqueous solution having a pH of from about 1 to about 14 and consisting essentially of an amine, nitro, and/or nitrate stripping component; and sodium glucoheptonate present in an effective amount to inhibit attack of the basis metal.

Abstract: A process and solution for electrolytically stripping metal deposits, particularly nickel and nickel-iron alloy deposits from a copper or copper alloy basis metal such as brass, for example, in which the aqueous stripping solution contains controlled effective amounts of halide salts, an organic carboxy acid, metal salts and mixtures thereof and hydrogen ions to provide a pH of less than about 5. The stripping of the metal deposit from the basis metal is effected by immersing the object in the stripping bath while anodically charged and passing electric current through the bath between the cathode and the object for a period of time sufficient to achieve the desired magnitude of stripping of the metal deposit.

Abstract: An improved electrolytic bath composition and process for stripping metal deposits from a different basis metal comprising an aqueous solution containing activating halogen compounds, an amine, nitro and/or nitrate stripping component, an inhibiting agent to inhibit attack of the basis metal comprising glucoheptonic acid, malic acid, and mixtures thereof, as well as the Group IA, IIA and ammonium salts thereof, and at least one bath soluble compound selected from the group consisting of thiocyanates, oxalates, and mixtures thereof. The stripping of the metal deposit is effected by immersion of the object in the bath while anodically charged and passing electric current through the bath to a cathode for a period of time suffient to achieve the desired magnitude of stripping of the metal deposit.

Abstract: An improved process and composition for chemically stripping metallic deposits from a substrate, and particularly, from the contact tips of electroplating racks and like apparatus to maintain proper operating efficiency thereof. The improved composition and method employs an aqueous acidic solution containing nitric acid, chloride ions and manganous ions present in an amount sufficient to accelerate the initiation of and the rate of stripping of the metallic deposits. The method and composition are applicable for chemically stripping a variety of metallic deposits at stripping rates substantially higher than those heretofore attainable with prior art compositions and techniques.

Abstract: An improved electrolytic bath composition and process for stripping metal deposits from a different basis metal comprising an aqueous solution containing activating halogen compounds, an amine, nitro and/or nitrate stripping component, and an inhibiting agent to inhibit attack of the basis metal comprising glucoheptonic acid, malic acid, and mixtures thereof as well as the Group IA, IIA and ammonium salts thereof. The stripping of the metal deposit is effected by immersion of the object in the bath while anodically charged and passing electric current through the bath to a cathode for a period of time sufficient to achieve the desired magnitude of stripping of the metal deposit.